Dish antenna using a projected artificial magnetic mirror

ABSTRACT

A flat dish antenna includes a plurality of concentric coils, a plurality of eccentric coils, a metal backing, a dielectric material, and an antenna structure. The pluralities of concentric coils and eccentric coils are on a layer of a substrate. A concentric coil has a radiation pattern that is substantially normal to a plane of the concentric coil and an eccentric coil has a radiation pattern that&#39;s is offset from normal to a plane of the eccentric coil. The metal backing is on another layer of the substrate and the dielectric material is between the layer and the other layer of the substrate. The concentric coils and the eccentric coils are electrically coupled to the metal backing to produce a distributed inductor-capacitor networking that provides a focal point based on a combination of their radiation patterns. The antenna structure is located proximal to the focal point.

CROSS REFERENCE TO RELATED PATENTS

This patent application is claiming priority under 35 USC §120 as acontinuing patent application of co-pending patent application entitled,“PROJECTED ARTIFICIAL MAGNETIC MIRROR”, having a filing date of Feb. 25,2011, and Ser. No. 13/034,957 (Attorney Docket # BP21799), whichapplication claims priority under 35 USC §119(e) to a provisionallyfiled patent application entitled, “PROJECTED ARTIFICIAL MAGNETICMIRROR”, having a provisional filing date of Apr. 11, 2010, and aprovisional Ser. No. 61/322,873 (Attorney Docket # BP21799), pending,which are hereby incorporated herein by reference in their entirety andmade part of the present U.S. Utility patent application for allpurposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

NOT APPLICABLE

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

NOT APPLICABLE

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

This invention relates generally to electromagnetism and moreparticularly to electromagnetic circuitry.

2. Description of Related Art

Artificial magnetic conductors (AMC) are known to suppress surface wavecurrents over a set of frequencies at the surface of the AMC. As such,an AMC may be used as a ground plane for an antenna or as a frequencyselective surface band gap.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to apparatus and methods of operationthat are further described in the following Brief Description of theDrawings, the Detailed Description of the Invention, and the claims.Other features and advantages of the present invention will becomeapparent from the following detailed description of the invention madewith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a diagram of an embodiment of a plurality of photonic crystalunit cells in accordance with the present invention;

FIG. 2 is a diagram of a theoretical representation of a crystal unitcell in accordance with the present invention;

FIG. 3 is a diagram of an example frequency response of a plurality ofphotonic crystal unit cells in accordance with the present invention;

FIG. 4 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells in accordance with the present invention;

FIG. 5 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells in accordance with the present invention;

FIG. 6 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells in accordance with the present invention;

FIG. 7 is a diagram of another embodiment of a plurality of photoniccrystal unit cells in accordance with the present invention;

FIG. 8 is a diagram of another embodiment of a plurality of photoniccrystal unit cells in accordance with the present invention;

FIG. 9 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells in accordance with the present invention;

FIG. 10 is a diagram of another example frequency response forcorresponding pluralities of photonic crystal unit cells in accordancewith the present invention;

FIG. 11 is a diagram of another example frequency response of aplurality of photonic crystal unit cells in accordance with the presentinvention;

FIG. 12 is a diagram of another example frequency response of aplurality of photonic crystal unit cells in accordance with the presentinvention;

FIG. 13 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells in accordance with the presentinvention;

FIG. 14 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells in accordance with the presentinvention;

FIG. 15 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells in accordance with the presentinvention;

FIG. 16 is a schematic block diagram of an embodiment of communicationdevices in accordance with the present invention;

FIG. 17 is a diagram of an embodiment of a transceiver section of acommunication device in accordance with the present invention;

FIG. 18 is a diagram of another embodiment of a transceiver section of acommunication device in accordance with the present invention;

FIG. 19 is a diagram of another embodiment of a transceiver section of acommunication device in accordance with the present invention;

FIG. 20 is a diagram of another embodiment of a transceiver section of acommunication device in accordance with the present invention;

FIG. 21 is a diagram of another embodiment of a transceiver section of acommunication device in accordance with the present invention;

FIG. 22 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 23 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 24 is a diagram of an embodiment of an antenna structure accordancewith the present invention;

FIG. 25 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 26 is a diagram of an embodiment of an isolation structure inaccordance with the present invention;

FIG. 27 is a diagram of an embodiment of an isolation structure inaccordance with the present invention;

FIG. 28 is a perspective diagram of an embodiment of an antennastructure in accordance with the present invention;

FIG. 29 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 30 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 31 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 32 is a diagram of an embodiment of an antenna structure inaccordance with the present invention;

FIG. 33 is a diagram of an embodiment of a projected artificial magneticmirror in accordance with the present invention;

FIG. 34 is a diagram of an embodiment of a projected artificial magneticmirror in accordance with the present invention;

FIG. 35 is a diagram of an embodiment of a projected artificial magneticmirror in accordance with the present invention;

FIG. 36 is a diagram of an embodiment of a projected artificial magneticmirror in accordance with the present invention;

FIG. 37 is a diagram of an embodiment of a projected artificial magneticmirror in accordance with the present invention;

FIGS. 38 a-38 e are diagrams of example modified Polya curves withvarying n values in accordance with the present invention;

FIGS. 39 a-39 c are diagrams of example modified Polya curves withvarying s values in accordance with the present invention;

FIGS. 40 a-40 b are diagrams of embodiments of antenna structures havinga modified Polya curve shape in accordance with the present invention;

FIGS. 41 a-41 h are diagrams of example shapes in which a modified Polyacurve is confined in accordance with the present invention;

FIG. 42 is a diagram of an example of programmable modified Polya curvesin accordance with the present invention;

FIG. 43 is a diagram of an embodiment of an antenna having a projectedartificial magnetic mirror having modified Polya curve traces inaccordance with the present invention;

FIG. 44 is a diagram of another embodiment of a projected artificialmagnetic mirror in accordance with the present invention;

FIG. 45 is a cross sectional diagram of an embodiment of a projectedartificial magnetic mirror in accordance with the present invention;

FIG. 46 is a schematic block diagram of an embodiment of a projectedartificial magnetic mirror in accordance with the present invention;

FIG. 47 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 48 is a schematic block diagram of another embodiment of aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 49 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 50 is a schematic block diagram of another embodiment of aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 51 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 52 is a diagram of an embodiment of an antenna having a projectedartificial magnetic mirror having spiral traces in accordance with thepresent invention;

FIG. 53 is a diagram of an example radiation pattern of a spiral coil inaccordance with the present invention;

FIG. 54 is a diagram of an example radiation pattern of a projectedartificial magnetic mirror having a plurality of spiral coils inaccordance with the present invention;

FIG. 55 is a diagram of an example radiation pattern of a conventionaldipole antenna in accordance with the present invention;

FIG. 56 is a diagram of an example radiation pattern of a dipole antennawith a projected artificial magnetic mirror in accordance with thepresent invention;

FIG. 57 is a diagram of an example radiation pattern of an eccentricspiral coil in accordance with the present invention;

FIG. 58 is a diagram of an example radiation pattern of a projectedartificial magnetic mirror having some eccentric and concentric spiralcoils in accordance with the present invention;

FIG. 59 is a diagram of another example radiation pattern of a projectedartificial magnetic mirror having some eccentric and concentric spiralcoils in accordance with the present invention;

FIG. 60 is a diagram of a projected artificial magnetic mirror havingsome eccentric and concentric spiral coils in accordance with thepresent invention;

FIG. 61 is a diagram of an embodiment of an effective dish antenna inaccordance with the present invention;

FIG. 62 is a diagram of another embodiment of an effective dish antennain accordance with the present invention;

FIG. 63 is a diagram of an embodiment of an effective dish antenna arrayin accordance with the present invention;

FIG. 64 is a diagram of an example application of an effective dishantenna array in accordance with the present invention;

FIG. 65 is a diagram of an example application of an effective dishantenna array in accordance with the present invention;

FIG. 66 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 67 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 68 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 69 is a cross sectional diagram of an example of an adjustable coilfor use in a projected artificial magnetic mirror in accordance with thepresent invention;

FIG. 70 is a cross sectional diagram of another example of an adjustablecoil for use in a projected artificial magnetic mirror in accordancewith the present invention;

FIG. 71 is a schematic block diagram of a projected artificial magneticmirror having adjustable coils in accordance with the present invention;

FIG. 72 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 73 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 74 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 75 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 76 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror in accordance with the presentinvention;

FIG. 77 is a diagram of an embodiment of an adjustable effective dishantenna array in accordance with the present invention;

FIG. 78 is a diagram of an embodiment of flip-chip connection having aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 79 is a schematic block diagram of an embodiment of communicationdevices communicating using electromagnetic communications in accordancewith the present invention;

FIG. 80 is a diagram of an embodiment of transceiver of a communicationdevice that communicates using electromagnetic communications inaccordance with the present invention;

FIG. 81 is a diagram of another embodiment of transceiver of acommunication device that communicates using electromagneticcommunications in accordance with the present invention;

FIG. 82 is a diagram of another embodiment of transceiver of acommunication device that communicates using electromagneticcommunications in accordance with the present invention;

FIG. 83 is a cross sectional diagram of an embodiment of an NFC coilhaving a projected artificial magnetic mirror in accordance with thepresent invention;

FIG. 84 is a cross sectional diagram of another embodiment of an NFCcoil having a projected artificial magnetic mirror in accordance withthe present invention;

FIG. 85 is a cross sectional diagram of another embodiment of an NFCcoil having a projected artificial magnetic mirror in accordance withthe present invention;

FIG. 86 is a cross sectional diagram of another embodiment of an NFCcoil having a projected artificial magnetic mirror in accordance withthe present invention;

FIG. 87 is a schematic block diagram of an embodiment of a radar systemhaving antenna structures that include a projected artificial magneticmirror in accordance with the present invention;

FIG. 88 is a schematic block diagram of another embodiment of a radarsystem having antenna structures that include a projected artificialmagnetic mirror in accordance with the present invention;

FIG. 89 is a schematic block diagram of another embodiment of a radarsystem having antenna structures that include a projected artificialmagnetic mirror in accordance with the present invention;

FIG. 90 is a schematic block diagram of an example of a radar systemhaving antenna structures that include a projected artificial magneticmirror tracking an object in accordance with the present invention;

FIG. 91 is a schematic block diagram of another example of a radarsystem having antenna structures that include a projected artificialmagnetic mirror tracking an object in accordance with the presentinvention;

FIG. 92 is a schematic block diagram of another example of a radarsystem having antenna structures that include a projected artificialmagnetic mirror tracking an object in accordance with the presentinvention;

FIG. 93 is a cross sectional diagram of an embodiment of a lateralantenna having a projected artificial magnetic mirror and a superstratedielectric layer in accordance with the present invention;

FIG. 94 is a schematic block diagram of another embodiment of a radarsystem having antenna structures that include a projected artificialmagnetic mirror in accordance with the present invention;

FIG. 95 is a cross section diagram of an embodiment of a radar systemhaving antenna structures that include a projected artificial magneticmirror in accordance with the present invention;

FIG. 96 is a schematic block diagram of an embodiment of a multiplefrequency band projected artificial magnetic mirror in accordance withthe present invention;

FIG. 97 is a cross sectional diagram of an embodiment of a multiplefrequency band projected artificial magnetic mirror in accordance withthe present invention;

FIG. 98 is a diagram of an embodiment of a MIMO antenna having aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 99 is a diagram of an embodiment of an antenna of a MIMO antennahaving a multiple frequency band projected artificial magnetic mirror inaccordance with the present invention;

FIG. 100 is a diagram of an embodiment of a dual band MIMO antennahaving a projected artificial magnetic mirror in accordance with thepresent invention;

FIG. 101 is a cross sectional diagram of an embodiment of a multipleprojected artificial magnetic mirrors on a common substrate inaccordance with the present invention;

FIG. 102 is a cross sectional diagram of an embodiment of a multipleprojected artificial magnetic mirrors on a common substrate inaccordance with the present invention;

FIGS. 103 a-d are diagrams of embodiments of a projected artificialmagnetic mirror waveguide in accordance with the present invention;

FIG. 104 is a diagram of an embodiment of an-chip projected artificialmagnetic mirror interface for in-band communications in accordance withthe present invention;

FIG. 105 is a cross sectional diagram of an embodiment of a projectedartificial magnetic mirror to a lower layer in accordance with thepresent invention;

FIG. 106 is a diagram of an embodiment of a transmission line having aprojected artificial magnetic mirror in accordance with the presentinvention;

FIG. 107 is a diagram of an embodiment of a filter having a projectedartificial magnetic mirror in accordance with the present invention;

FIG. 108 is a diagram of an embodiment of an inductor having a projectedartificial magnetic mirror in accordance with the present invention; and

FIG. 109 is a cross sectional diagram of an embodiment of an antennahaving a coplanar projected artificial magnetic mirror in accordancewith the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a diagram of an embodiment of a plurality of photonic crystalunit cells 10 that includes layers of planar arrays of metal scatters12. Each layer of metal scatters 12 includes an integration (dielectric)layer 14 and a plurality of photonic crystal unit cells 10 (e.g., metaldiscs). A monolayer 16 of photonic crystal unit cells 10 may beconfigured as shown.

FIG. 2 is a diagram of a theoretical representation of a crystal unitcell 10 having a propagation matrix 18, a scatter matrix 20, and asecond propagation matrix 22. An analytical solution for the disc mediummay be expressed as follows:

$B_{D}^{D} = {\frac{16}{3}\left( \frac{r}{a} \right)^{2}{\frac{kr}{\cos \; \theta_{d}}\left\lbrack {\frac{1}{1 - {\frac{8}{3}\left( \frac{r}{a} \right)^{3}C_{e}}} - {\frac{\sin^{2}\theta_{d}}{2}\frac{1}{1 - {\frac{4}{3}\left( \frac{r}{a} \right)^{3}C_{m}}}}} \right\rbrack}}$

where kr is a scatter electromagnetic size, θd is the incidence angle inthe dielectric, a is the scatter size with respect to UC (approximatefilling fraction), Cc and Cm are electric and magnetic couplingconstants.

$B_{RC}^{D} = {\frac{16}{3}\left( \frac{r}{a} \right)^{2}\frac{kr}{\cos \; \theta_{d}}{({kr})^{2}\left\lbrack {\frac{8}{15} - \frac{\sin^{2}\theta_{d}}{6} - \frac{\sin^{4}\theta_{d}}{150}} \right\rbrack}}$

where the parenthetic term corresponds to the quadrupole radioactivecorrections.

This analytical solution is valid for any angle of incidence and anypolarization. Such a solution may also be applied for cylindricalexcitations and modal excitations in rectangular or circular waveguides.Further, the solution may have a validity range within dominantpropagating mode with possible extensions.

Continuing the preceding equations, Electric & Magnetic couplings of asquare planar array may be expressed as:

$C_{e} = {{\frac{1}{\pi}\left\lbrack {1.2 - {8\pi^{2}{K_{0}\left( {2\pi} \right)}}} \right\rbrack} + {\frac{({ka})^{2}}{2\pi}\left\lbrack {{{- \ln}\; 4\; \pi} + \frac{1}{2} + \frac{({ka})^{2}}{48} - {i\left( {\left( \frac{ka}{3} \right) - \frac{\pi}{{ka}\; \cos \; \theta_{d}}} \right)} + {\pi {\sum\limits_{l = 1}^{\infty}\left( {\frac{1}{a\; \Gamma_{1}} + \frac{1}{a\; \Gamma_{- l}} - \frac{1}{l\; \pi}} \right)}}} \right\rbrack} + {({ka})^{2}\left\lbrack {{\left( {\frac{2}{\pi} + {4\; \pi \; \sin^{2}\theta_{d}}} \right){K_{0}\left( {2\pi} \right)}} - {2{K_{1}\left( {2\pi} \right)}}} \right\rbrack}}$$C_{m} = {{- {\frac{1}{2\pi}\left\lbrack {1.2 + \frac{\pi^{2}}{3} - {8\pi \; {K_{1}\left( {2\pi} \right)}}} \right\rbrack}} - {\frac{({ka})^{2}}{4\pi}{\quad{\begin{bmatrix}{1 - \gamma + {\left( {1 - {\cos \; {ka}}} \right){\ln \left( \frac{8\pi}{({ka})^{2}} \right)}} + \frac{({ka})^{2}}{48} - {2{i\left( {\left( \frac{ka}{3} \right) - \frac{{\pi sin}^{2}\theta_{d}}{{ka}\; \cos \; \theta_{d}}} \right)}} -} \\{2\pi {\sum\limits_{l = 1}^{\infty}\left( {\frac{1}{a\; \Gamma_{l}} + \frac{1}{a\; \Gamma_{- l}} - \frac{1}{2l\; \pi} + \frac{{a\; \Gamma_{l}} + {a\; \Gamma_{- l}} - {4l\; \pi}}{({ka})^{2}}} \right)}}\end{bmatrix} + {\frac{({ka})^{2}}{\pi}\left\lbrack {{2{K_{0}\left( {2\pi} \right)}} - {K_{2}\left( {2\pi} \right)}} \right\rbrack}}}}}$

Reconstructing the S-parameters yields:

${S_{11}^{(i)} = \frac{{\Psi_{i}\left( \frac{1 - \left\lbrack \xi_{i} \right\rbrack^{N}}{2\tau_{i}\zeta_{i}} \right)}\left( {\eta_{-}^{(i)} - {\eta_{+}^{(i)}\frac{Y_{i}}{2\Psi_{i}}}} \right)}{1 + \left\lbrack \xi_{i} \right\rbrack^{N} + {{\Psi_{i}\left( \frac{1 - \left\lbrack \xi_{i} \right\rbrack^{N}}{2\tau_{i}\zeta_{i}} \right)}\left( {\eta_{+}^{(i)} - {\eta_{-}^{(i)}\frac{Y_{i}}{2\Psi_{i}}}} \right)}}},{S_{21}^{(i)} = \frac{\left( \frac{2}{\left( {1 + \zeta_{i}} \right)^{N}\tau_{i}^{N}} \right)}{1 + \left\lbrack \xi_{i} \right\rbrack^{N} + {{\Psi_{i}\left( \frac{1 - \left\lbrack \xi_{i} \right\rbrack^{N}}{2\tau_{i}\zeta_{i}} \right)}\left( {\eta_{+}^{(i)} - {\eta_{-}^{(i)}\frac{Y_{i}}{2\Psi_{i}}}} \right)}}}$Ψ_(i) = j sin (k₀cn cos (θ_(d))) + cos (k₀cn cos (θ_(d)))Y_(i)τ_(i) = cos (k₀cn cos (θ_(d))) + j sin (k₀cn cos (θ_(d)))Y_(i)${\zeta_{i} = {\frac{\Psi_{i}}{\tau_{i}}\sqrt{1 - \left( \frac{Y_{i}}{\Psi_{i}} \right)^{2}}}},{\xi_{i} = \frac{1 - \zeta_{i}}{1 + \zeta_{i}}},{\eta_{\pm}^{i} = {\frac{\eta_{a}^{i}}{\eta_{d}^{i}} \pm \frac{\eta_{d}^{i}}{\eta_{a}^{i}}}}$${\eta_{\alpha}^{i} = \frac{\eta_{\alpha}}{\cos^{i}\theta_{\alpha}}},{\eta_{\alpha} = \sqrt{\frac{\mu_{\alpha}}{ɛ_{\alpha}}}},{\alpha \in \left\{ {{a = {air}},{d = {dielectric}}} \right\}},{i \in \left\{ {1,{- 1}} \right\}},$

where cn corresponds to a host refractive index, na corresponds to awave impedance, and i corresponds to polarization.

FIG. 3 is a diagram of an example frequency response of a plurality ofphotonic crystal unit cells. In a first frequency band, the photoniccrystal cells provide a low-frequency dielectric 24; in a secondfrequency band, the photonic crystal cells provide a firstelectromagnetic band gap (EBG) 26; in a third frequency band, thephotonic crystal cells provide a bandpass filter 28; and in a fourthfrequency band, the photonic crystal cells provide a second EBG 30.

In this example, the photonic crystal cells are designed to provide theabove-mentioned characteristics in a frequency range up to 40 GHz. Witha different design, the photonic crystal cells may provide one or moreof the above-mentioned characteristics at other frequencies. Forexample, it may be desirable to have the photonic crystal cells providea bandpass filter at 60 GHz, an electromagnetic band gap (EBG) at 60GHz, etc. As another example, it may be desirable to have the photoniccrystal cells provide one or more of the above-mentioned characteristicsat other microwave frequencies (e.g., 3 GHz to 300 GHz).

FIG. 4 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells. For instance, the graphs illustrateeffective response functions and the development of resonantmagnetization for the photonic crystal cells, respectively.

With reference to the graphs, artificial magnetism develops innon-magnetic metalo-dielectric Photonic Crystals from stackingalternating current sheets in the Photonic Crystal to create a strongmagnetic dipole density for specific frequency bands. The correspondingmagnetization for the k+1-pair of monolayers is parallel to the totalmagnetic field at that location and is given by:

$M^{({k + 1})} = {\frac{1}{2}J_{s}^{({{2k} + 1})}\hat{x}}$

where J_(s) ^((2k+1)) is the surface current density at one monolayer ofthe pair. The adjacent monolayer of the pair has the opposite currentdensity. This sheet of magnetic dipoles gives rise to a total magneticdipole moment and the corresponding artificial magnetization. It onlyoccurs inside Electromagnetic Band Gaps. This creates the phenomenon ofArtificial Magnetic Conductors (AMC's) in the Photonic Crystals.

FIG. 5 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells. This graph illustrates variousproperties of metamorphic materials, such as the photonic crystals. Insuch materials, the reflection coefficient for a semi-infinite mediumonly depends on the complex wave impedance, which may be expressed as:

${\Gamma = \frac{\eta - 1}{\eta + 1}},{\eta = \sqrt{\frac{\mu}{ɛ}}}$

Varying the n term, the various properties of the material areexhibited. For example, setting n to +/−0.1 produces the property of anelectric wall 32; setting n to +/−0.5 produces the property of anamplifier 34; setting n to +/−1 produces the property of an absorber 36;and setting n to +/−10 produces the property of a magnetic wall 38.

FIG. 6 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells. In particular, this diagram illustratesthe various properties of the metamorphic material over variousconditions (e.g., varying k₀c).

FIG. 7 is a diagram of another embodiment of a plurality of photoniccrystal unit cells 10. In this diagram, the metamorphic material isreconfigurable to achieve electromagnetic transitions at approximatelythe same frequency. Each of the cells includes one or more switches 40(e.g., diodes and/or MEMS switches) to couple the cells to produce aphotonic crystal or the complement thereof.

FIG. 8 is a diagram of another embodiment of a plurality of photoniccrystal unit cells 10. In this example, the first and third layers ofcells have their respective switches 40 opened while the cells on thesecond layer have their respective switches 40 closed. In thisconfiguration, the first and third layers provide similar current sheetsand the second layer provides a complimentary current sheet.

FIG. 9 is a diagram of another example frequency response of a pluralityof photonic crystal unit cells. With reference to this diagram, theanalytical solution for Babinet's principle of complimentary screens canbe formalized in Booker's relation. In this regard, the metamorphicmaterial (e.g., the photonic crystal) may be tuned to provide thecapacitive based characteristics as shown in graph on the left of thefigure and the inductive based characteristics as shown in the graph onthe right of the figure.

FIG. 10 is a diagram of another example frequency response forcorresponding pluralities of photonic crystal unit cells. In thisdiagram, the graph on the left corresponds to the photonic crystal shownbelow it (e.g., the switches of the cells on each layer are open). Thegraph on the right of the diagram illustrates the characteristics of thephotonic crystal when the switches of the cells on each layer areclosed.

FIG. 11 is a diagram of another example frequency response of aplurality of photonic crystal unit cells. In this diagram, the openingand closing of switches on the various layers is adjusted. For the graphon the left, the solid thin line represents characteristics on thephotonic crystal when the switches on the first and third layers areopen and the switches on the second layer are closed; the dash linecorresponds to the characteristics when the switches on the layers areopen; and the solid thick line corresponds to the characteristics whenthe switches on the layers are closed.

For the graph on the right, the solid thin line representscharacteristics on the photonic crystal when the switches on the firstand third layers are closed and the switches on the second layer areopen; the dash line corresponds to the characteristics when the switcheson the layers are open; and the solid thick line corresponds to thecharacteristics when the switches on the layers are closed.

FIG. 12 is a diagram of another example frequency response of aplurality of photonic crystal unit cells. In this diagram, therefractive index is plotted over frequency and corresponds to theeffective response functions through resonant inverse scattering. Assuch, the photonic crystals may be characterized as homogenizedmetamaterials through the S-parameters and an analytical inversescattering method. This leads to the derivation of complex functions{ε(ω), μ(ω)} or equivalently {n(ω), η(ω)}, which are valid for resonantfrequency regions. Mathematically, this may be expressed as:

${\eta = {\frac{1 + A}{1 - A} = {\pm \sqrt{\frac{V + 1}{V - 1}}}}},{A = {V \pm \sqrt{V^{2} - 1}}},$

where n is the complex wave impedance;

${{{Re}(n)} = \frac{\arccos \left( {{Re}{\left\{ x \right\}/{x}}} \right)}{k_{0}d}},{{{Im}(n)} = {- \frac{\ln {x}}{k_{0}d}}},$

where Re(n) and Im(n) are complex refractive index;

${V = \frac{1 + S_{11}^{2} - S_{21}^{2}}{2S_{11}}},{x = \frac{S}{1 + R - {A\; S\; R}}},{S = {S_{11} + S_{21}}},{R = \frac{S_{11}}{S_{21}}}$$\left\{ {{ɛ(\omega)},{\mu (\omega)}} \right\} = \left\{ {\frac{n(\omega)}{\eta (\omega)},{{n(\omega)} \cdot {\eta (\omega)}}} \right\}$

FIG. 13 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells. These graphs represent theimpedance characterization for a photonic sample and illustrate that thecomplex functions {ε(ω), μ(ω)}, {n(ω), η(ω)} are independent of thephotonic crystal thickness, which provides proof of the validity of thehomogenized description.

FIG. 14 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells. These graphs represent theimpedance characterization for a photonic sample having a shorted diskmedium.

FIG. 15 is a diagram of additional example frequency responses of aplurality of photonic crystal unit cells. In particular, the graph onthe left illustrates the refractive index over frequency for variousswitch configurations of the layers of the photonic crystal and thegraph on the right illustrates the permittivity over frequency forvarious switch configurations of the layers of the photonic crystal.

In both graphs, the solid thin line corresponds to having the switchesopen on each of the layers; the dash line corresponds to the switchesbeing closed on each of the layers; and the solid thick line correspondsto the switches on the first and third layers being open and theswitches on the second layer being closed.

FIG. 16 is a schematic block diagram of an embodiment of communicationdevices 42 communicating via radio frequency (RF) and/or millimeter wave(MMW) communication mediums 44. Each of the communication devices 42includes a baseband processing module 46, a transmitter section 48, areceiver section 50, and an RF &/or MMW antenna structure 52 (e.g., awireless communication structure). The RF &/or MMW antenna structure 52will be described in greater detail with reference to one or more ofFIGS. 17-78. Note that a communication device 42 may be a cellulartelephone, a wireless local area network (WLAN) client, a WLAN accesspoint, a computer, a video game console, a location device, a radardevice, and/or player unit, etc.

The baseband processing module 46 may be implemented via a processingmodule that may be a single processing device or a plurality ofprocessing devices. Such a processing device may be a microprocessor,micro-controller, digital signal processor, microcomputer, centralprocessing unit, field programmable gate array, programmable logicdevice, state machine, logic circuitry, analog circuitry, digitalcircuitry, and/or any device that manipulates signals (analog and/ordigital) based on hard coding of the circuitry and/or operationalinstructions. The processing module may have an associated memory and/ormemory element, which may be a single memory device, a plurality ofmemory devices, and/or embedded circuitry of the processing module. Sucha memory device may be a read-only memory, random access memory,volatile memory, non-volatile memory, static memory, dynamic memory,flash memory, cache memory, and/or any device that stores digitalinformation. Note that if the processing module includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that when the processing module implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element stores, and the processing module executes,hard coded and/or operational instructions corresponding to at leastsome of the steps and/or functions illustrated in FIGS. 16-78.

In an example of operation, one of the communication devices 42 has data(e.g., voice, text, audio, video, graphics, etc.) to transmit to theother communication device 42. In this instance, the baseband processingmodule 46 receives the data (e.g., outbound data) and converts it intoone or more outbound symbol streams in accordance with one or morewireless communication standards (e.g., GSM, CDMA, WCDMA, HSUPA, HSDPA,WiMAX, EDGE, GPRS, IEEE 802.11, Bluetooth, ZigBee, universal mobiletelecommunications system (UMTS), long term evolution (LTE), IEEE802.16, evolution data optimized (EV-DO), etc.). Such a conversionincludes one or more of: scrambling, puncturing, encoding, interleaving,constellation mapping, modulation, frequency spreading, frequencyhopping, beamforming, space-time-block encoding, space-frequency-blockencoding, frequency to time domain conversion, and/or digital basebandto intermediate frequency conversion. Note that the baseband processingmodule 46 converts the outbound data into a single outbound symbolstream for Single Input Single Output (SISO) communications and/or forMultiple Input Single Output (MISO) communications and converts theoutbound data into multiple outbound symbol streams for Single InputMultiple Output (SIMO) and Multiple Input Multiple Output (MIMO)communications.

The transmitter section 48 converts the one or more outbound symbolstreams into one or more outbound RF signals that has a carrierfrequency within a given frequency band (e.g., 2.4 GHz, 5 GHz, 57-66GHz, etc.). In an embodiment, this may be done by mixing the one or moreoutbound symbol streams with a local oscillation to produce one or moreup-converted signals. One or more power amplifiers and/or poweramplifier drivers amplifies the one or more up-converted signals, whichmay be RF bandpass filtered, to produce the one or more outbound RFsignals. In another embodiment, the transmitter section 48 includes anoscillator that produces an oscillation. The outbound symbol stream(s)provides phase information (e.g., +/−Δθ [phase shift] and/or θ(t) [phasemodulation]) that adjusts the phase of the oscillation to produce aphase adjusted RF signal(s), which is transmitted as the outbound RFsignal(s). In another embodiment, the outbound symbol stream(s) includesamplitude information (e.g., A(t) [amplitude modulation]), which is usedto adjust the amplitude of the phase adjusted RF signal(s) to producethe outbound RF signal(s).

In yet another embodiment, the transmitter section 48 includes anoscillator that produces an oscillation(s). The outbound symbolstream(s) provides frequency information (e.g., +/−Δf [frequency shift]and/or f(t) [frequency modulation]) that adjusts the frequency of theoscillation to produce a frequency adjusted RF signal(s), which istransmitted as the outbound RF signal(s). In another embodiment, theoutbound symbol stream(s) includes amplitude information, which is usedto adjust the amplitude of the frequency adjusted RF signal(s) toproduce the outbound RF signal(s). In a further embodiment, thetransmitter section 48 includes an oscillator that produces anoscillation(s). The outbound symbol stream(s) provides amplitudeinformation (e.g., +/−ΔA [amplitude shift] and/or A(t) [amplitudemodulation) that adjusts the amplitude of the oscillation(s) to producethe outbound RF signal(s).

The RF &/or MMW antenna structure 52 receives the one or more outboundRF signals and transmits it. The RF &/or MMW antenna structure 52 of theother communication devices 42 receives the one or more RF signals andprovides it to the receiver section 50.

The receiver section 50 amplifies the one or more inbound RF signals toproduce one or more amplified inbound RF signals. The receiver section50 may then mix in-phase (I) and quadrature (Q) components of theamplified inbound RF signal(s) with in-phase and quadrature componentsof a local oscillation(s) to produce one or more sets of a mixed Isignal and a mixed Q signal. Each of the mixed I and Q signals arecombined to produce one or more inbound symbol streams. In thisembodiment, each of the one or more inbound symbol streams may includephase information (e.g., +/−Δθ [phase shift] and/or θ(t) [phasemodulation]) and/or frequency information (e.g., +/−Δf [frequency shift]and/or f(t) [frequency modulation]). In another embodiment and/or infurtherance of the preceding embodiment, the inbound RF signal(s)includes amplitude information (e.g., +/−ΔA [amplitude shift] and/orA(t) [amplitude modulation]). To recover the amplitude information, thereceiver section 50 includes an amplitude detector such as an envelopedetector, a low pass filter, etc.

The baseband processing module 46 converts the one or more inboundsymbol streams into inbound data (e.g., voice, text, audio, video,graphics, etc.) in accordance with one or more wireless communicationstandards (e.g., GSM, CDMA, WCDMA, HSUPA, HSDPA, WiMAX, EDGE, GPRS, IEEE802.11, Bluetooth, ZigBee, universal mobile telecommunications system(UMTS), long term evolution (LTE), IEEE 802.16, evolution data optimized(EV-DO), etc.). Such a conversion may include one or more of: digitalintermediate frequency to baseband conversion, time to frequency domainconversion, space-time-block decoding, space-frequency-block decoding,demodulation, frequency spread decoding, frequency hopping decoding,beamforming decoding, constellation demapping, deinterleaving, decoding,depuncturing, and/or descrambling. Note that the baseband processingmodule converts a single inbound symbol stream into the inbound data forSingle Input Single Output (SISO) communications and/or for MultipleInput Single Output (MISO) communications and converts the multipleinbound symbol streams into the inbound data for Single Input MultipleOutput (SIMO) and Multiple Input Multiple Output (MIMO) communications.

FIG. 17 is a diagram of an embodiment of an integrated circuit (IC) 54that includes a package substrate 56 and a die 58. The die 58 includes abaseband processing module 60, an RF transceiver 62, a local antennastructure 64, and a remote antenna structure 66. Such an IC 54 may beused in the communication devices 42 of FIG. 16 and/or for otherwireless communication devices.

In an embodiment, the IC 54 supports local and remote communications,where local communications are of a very short range (e.g., less than0.5 meters) and remote communications are of a longer range (e.g.,greater than 1 meter). For example, local communications may be IC to ICcommunications, IC to board communications, and/or board to boardcommunications within a device and remote communications may be cellulartelephone communications, WLAN communications, Bluetooth piconetcommunications, walkie-talkie communications, etc. Further, the contentof the remote communications may include graphics, digitized voicesignals, digitized audio signals, digitized video signals, and/oroutbound text signals.

FIG. 18 is a diagram of an embodiment of an integrated circuit (IC) 54that includes a package substrate 56 and a die 58. This embodiment issimilar to that of FIG. 17 except that the remote antenna structure 66is on the package substrate 56. Accordingly, IC 54 includes a connectionfrom the remote antenna structure 66 on the package substrate 56 to theRF transceiver 62 on the die 58.

FIG. 19 is a diagram of an embodiment of an integrated circuit (IC) 54that includes a package substrate 56 and a die 58. This embodiment issimilar to that of FIG. 17 except that both the local antenna structure64 and the remote antenna structure 66 on the package substrate 56.Accordingly, IC 54 includes connections from the remote antennastructure 66 on the package substrate 56 to the RF transceiver 62 on thedie 58 and form the local antenna structure 64 on the package substrate56 to the RF transceiver 62 on the die 58.

FIG. 20 is a diagram of an embodiment of an integrated circuit (IC) 70that includes a package substrate 72 and a die 74. The die 74 includes acontrol module 76, an RF transceiver 78, and a plurality of antennastructures 80. The control module 76 may be a single processing deviceor a plurality of processing devices (as previously defined). Note thatthe IC 70 may be used in the communication devices 42 of FIG. 16 and/orin other wireless communication devices.

In operation, the control module 76 configures one or more of theplurality of antenna structures 80 to provide the inbound RF signal 82to the RF transceiver 78. In addition, the control module 76 configuresone or more of the plurality of antenna structures 80 to receive theoutbound RF signal 84 from the RF transceiver 78. In this embodiment,the plurality of antenna structures 80 is on the die 74. In an alternateembodiment, a first antenna structure of the plurality of antennastructures 80 is on the die 74 and a second antenna structure of theplurality of antenna structures 80 is on the package substrate 72. Notethat an antenna structure of the plurality of antenna structures 80 mayinclude one or more of an antenna, a transmission line, a transformer,and an impedance matching circuit.

The RF transceiver 78 converts the inbound RF signal 82 into an inboundsymbol stream. In one embodiment, the inbound RF signal 82 has a carrierfrequency in a frequency band of approximately 55 GHz to 64 GHz. Inaddition, the RF transceiver 78 converts an outbound symbol stream intothe outbound RF signal, which has a carrier frequency in the frequencyband of approximately 55 GHz to 64 GHz.

FIG. 21 is a diagram of an embodiment of an integrated circuit (IC) 70that includes a package substrate 72 and a die 74. This embodiment issimilar to that of FIG. 20 except that the plurality of antennastructures 80 is on the package substrate 72. Accordingly, IC 70includes a connection from the plurality of antenna structures 80 on thepackage substrate 72 to the RF transceiver 78 on the die 74.

FIG. 22 is a diagram of an embodiment of an antenna structure 90 that isimplemented on one or more layers 88 of a die 86 of an integratedcircuit (IC). The die 86 includes a plurality of layers 88 and may be ofa CMOS fabrication process, a Gallium Arsenide fabrication process, orother IC fabrication process. In this embodiment, one or more antennas90 are fabricated as one or more metal traces of a particular length andshape based on the desired antenna properties (e.g., frequency band,bandwidth, impedance, quality factor, etc.) of the antenna(s) 90 on anouter layer of the die 86.

On an inner layer, which is a distance “d” from the layer supporting theantenna(s), a projected artificial magnetic mirror (PAMM) 92 isfabricated. The PAMM 92 may be fabricated in one of a plurality ofconfigurations as will be discussed in greater detail with reference toone or more of FIGS. 33-63. The PAMM 92 may be electrically coupled to ametal backing 94 (e.g., ground plane) of the die 86 by one or more vias96. Alternatively, the PAMM 92 may be capacitively coupled to the metalbacking 94 (i.e., is not directly coupled to the metal backing 94 by avia 96, but through the capacitive coupling of the metal elements of thePAMM 92 and the metal backing 94).

The PAMM 92 functions as an electric field reflector for the antenna(s)90 within a given frequency band. In this manner, circuit components 98(e.g., the baseband processor, the components of the transmitter sectionand receiver section, etc.) fabricated on other layers of the die 86 aresubstantially shielded from the RF and/or MMW energy of the antenna. Inaddition, the reflective nature of the PAMM 92 improves the gain of theantenna(s) 90 by 3 dB or more.

FIG. 23 is a diagram of an embodiment of an antenna structure 100 thatis implemented on one or more layers of a package substrate 102 of anintegrated circuit (IC). The package substrate 100 includes a pluralityof layers 104 and may be a printed circuit board or other type ofsubstrate. In this embodiment, one or more antennas 100 are fabricatedas one or more metal traces of a particular length and shape based onthe desired antenna properties of the antenna(s) 100 on an outer layerof the package substrate 102.

On an inner layer of the package substrate 100, a projected artificialmagnetic mirror (PAMM) 106 is fabricated. The PAMM 106 may be fabricatedin one of a plurality of configurations as will be discussed in greaterdetail with reference to one or more of FIGS. 33-63. The PAMM 106 may beelectrically coupled to a metal backing 110 (e.g., ground plane) of thedie 108 by one or more vias 112. Alternatively, the PAMM 106 may becapacitively coupled to the metal backing 110.

FIG. 24 is a diagram of an embodiment of an antenna structure 114 thatis similar to the antenna structure of FIG. 22 with the exception thatthe antenna(s) 114 are fabricated on two or more layers 88 of the die86. The different layers of the antenna 114 may be coupled in a seriesmanner and/or in a parallel manner to achieve the desired properties(e.g., frequency band, bandwidth, impedance, quality factor, etc.) ofthe antenna(s) 114.

FIG. 25 is a diagram of an embodiment of an antenna structure 116 thatis similar to the antenna structure of FIG. 23 with the exception thatthe antenna(s) 116 are fabricated on two or more layers 104 of thepackage substrate 102. The different layers of the antenna 116 may becoupled in a series manner and/or in a parallel manner to achieve thedesired properties (e.g., frequency band, bandwidth, impedance, qualityfactor, etc.) of the antenna(s) 116.

FIG. 26 is a diagram of an embodiment of an isolation structurefabricated on a die 118 of an integrated circuit (IC). The die 118includes a plurality of layers 120 and may be of a CMOS fabricationprocess, a Gallium Arsenide fabrication process, or other IC fabricationprocess. In this embodiment, one or more noisy circuits 122 arefabricated on an outer layer of the die 118. Such noisy circuits 122include, but are not limited to, digital circuits, logic gates, memory,processing cores, etc.

On an inner layer, which is a distance “d” from the layer supporting thenoisy circuits 122, a projected artificial magnetic mirror (PAMM) 124 isfabricated. The PAMM 124 may be fabricated in one of a plurality ofconfigurations as will be discussed in greater detail with reference toone or more of FIGS. 33-63. The PAMM 124 may be electrically coupled toa metal backing 126 (e.g., ground plane) of the die 118 by one or morevias 128. Alternatively, the PAMM 124 may be capacitively coupled to themetal backing 126 (i.e., is not directly coupled to the metal backing126 by a via 128, but through the capacitive coupling of the metalelements of the PAMM 124 and the metal backing 126).

The PAMM 124 functions as an electric field reflector for the noisycircuits 122 within a given frequency band. In this manner, noisesensitive circuit components 130 (e.g., analog circuits, amplifiers,etc.) fabricated on other layers of the die 118 are substantiallyshielded from the in-band RF and/or MMW energy of the noisy circuits130.

FIG. 27 is a diagram of an embodiment of an isolation structure that isimplemented on one or more layers of a package substrate 132 of anintegrated circuit (IC). The package substrate 132 includes a pluralityof layers 134 and may be a printed circuit board or other type ofsubstrate. In this embodiment, one or more noisy circuits 136 arefabricated on an outer layer of the package substrate 132.

On an inner layer of the package substrate 132, a projected artificialmagnetic mirror (PAMM) 138 is fabricated. The PAMM 138 may be fabricatedin one of a plurality of configurations as will be discussed in greaterdetail with reference to one or more of FIGS. 33-63. The PAMM 138 may beelectrically coupled to a metal backing 140 (e.g., ground plane) of thedie 132 by one or more vias 142. Alternatively, the PAMM 138 may becapacitively coupled to the metal backing 140 and provides shielding forthe noise sensitive components 144 from in-band RF and/or MMW energy ofthe noisy circuits 144.

FIG. 28 is a perspective diagram of an embodiment of an antennastructure coupled to one or more circuit components. The antennastructure includes a dipole antenna 146 fabricated on an outer layer 148of a die and/or package substrate and a projected artificial magneticmirror (PAMM) 150 fabricated on an inner layer 152 of the die and/orpackage substrate. The circuit components 154 are fabricated on one ormore layers of the die and/or package substrate, which may be the bottomlayer 158. A metal backing 160 is fabricated on the bottom layer 158.While not shown, the antenna structure may further include atransmission line and an impedance matching circuit.

The projected artificial magnetic mirror (PAMM) 150 includes at leastone opening to allow one or more antenna connections 156 to passthere-through, thus enabling electrical connection of the antenna to oneor more of the circuit components 154 (e.g., a power amplifier, a lownoise amplifier, a transmit/receive switch, an circulator, etc.). Theconnections may be metal vias that may or may not be insulated.

FIG. 29 is a diagram of an embodiment of an antenna structure on a dieand/or on a package substrate. The antenna structure includes an antennaelement 162, a projected artificial magnetic mirror (PAMM) 164, and atransmission line. In this embodiment, the antenna element 162 isvertically positioned with respect to the PAMM 164 and has a length ofapproximately ¼ wavelength of the RF and/or MMW signals it transceives.The PAMM 164 may be circular shaped, elliptical shaped, rectangularshaped, or any other shape to provide an effective ground for theantenna element 162. The PAMM 162 includes an opening to enable thetransmission line to be coupled to the antenna element 162.

FIG. 30 is a cross sectional diagram of the embodiment of an antennastructure of FIG. 29. The antenna structure includes the antenna element162, the PAMM 164, and the transmission line 166. In this embodiment,the antenna element 162 is vertically positioned with respect to thePAMM 164 and has a length of approximately ¼ wavelength of the RF and/orMMW signals it transceives. As shown, the PAMM 164 includes an openingto enable the transmission line to be coupled to the antenna element162.

FIG. 31 is a diagram of an embodiment of an antenna structure on a dieand/or on a package substrate. The antenna structure includes aplurality of discrete antenna elements 168, a projected artificialmagnetic mirror (PAMM) 170, and a transmission line. In this embodiment,the plurality of discrete antenna elements 168 includes a plurality ofinfinitesimal antennas (i.e., have a length <= 1/50 wavelength) or aplurality of small antennas (i.e., have a length <= 1/10 wavelength) toprovide a discrete antenna structure, which functions similarly to acontinuous horizontal dipole antenna. The PAMM 170 may be circularshaped, elliptical shaped, rectangular shaped, or any other shape toprovide an effective ground for the plurality of discrete antennaelements 168.

FIG. 32 is a diagram of an embodiment of an antenna structure on a dieand/or on a package substrate. The antenna structure includes an antennaelement, a projected artificial magnetic mirror (PAMM) 182, and atransmission line. In this embodiment, the antenna element includes aplurality of substantially enclosed metal traces and vias. Thesubstantially enclosed metal traces may have a circular shape, anelliptical shape, a square shape, a rectangular shape and/or any othershape.

In one embodiment, a first substantially enclosed metal trace 172 is ona first metal layer 174, a second substantially enclosed metal trace 178is on a second metal layer 180, and a via 176 couples the firstsubstantially enclosed metal trace 172 to the second substantiallyenclosed metal trace 178 to provide a helical antenna structure. ThePAMM 182 may be circular shaped, elliptical shaped, rectangular shaped,or any other shape to provide an effective ground for the antennaelement. The PAMM 182 includes an opening to enable the transmissionline to be coupled to the antenna element.

FIGS. 33-51 illustrate various embodiments and/or aspects of a projectedartificial magnetic mirror (PAMM), which will be subsequently discussed.In general, a PAMM 184 includes a plurality of conductive coils, a metalbacking and a dielectric material. The plurality of conductive coils isarranged in an array (e.g., circular, rectangular, etc.) on a firstlayer of a substrate (e.g., printed circuit board, integrated circuit(IC) package substrate, and/or an IC die). The metal backing is on asecond layer of the substrate. The dielectric material (e.g., materialof a printed circuit board, non-metal layer of an IC, etc.) is betweenthe first and second layers of the substrate. For instance, theplurality of conductive coils may be on an inner layer of the substrateand the metal backing is on an outer layer with respect to theconductive coil layer.

The conductive coils are electrically coupled to the metal backing by avia (e.g., a direct electrical connection) or by a capacitive coupling.As coupled, the conductive coils and the metal backing 190 form aninductive-capacitive network that substantially reduces surface waves ofa given frequency band along a third layer of the substrate. Note thatthe first layer is between the second and third layers. In this manner,the PAMM provides an effective magnetic mirror at the third layer suchthat circuit elements (e.g., inductor, filter, antenna, etc.) on thethird layer are electromagnetically isolated from electromagneticsignals on the other side of the conductive coil layer. In addition,electromagnetic signals on the side of the conductive coil layer aremirror back to the circuit elements on the third layer such that theyare additive or subtractive (depending on distance and frequency) to theelectromagnetic signal received and/or generated by the circuit element.

The size, shape, and distance “d” between the first, second, and thirdlayers effect the magnetic mirroring properties of the PAMM 184. Forexample, a conductive coil may have a shape that includes at least oneof be circular, square, rectangular, hexagon, octagon, and ellipticaland a pattern that includes at least one of interconnecting branches, ann^(th) order Peano curve, and an n^(th) order Hilbert curve. Each of theconductive coils may have the same shape, the same pattern, differentshapes, different patterns, and/or programmable sizes and/or shapes. Forexample, a first conductive includes a first size, a first shape, and afirst pattern and a second conductive coil includes a second size, asecond shape, and a second pattern. As a specific example, a conductivecoil may have a length that is less than or equal to ½ wavelength of amaximum frequency of the given frequency band.

FIG. 33 is a diagram of an embodiment of a projected artificial magneticmirror 184 on a single layer that includes a plurality of metal patches186. Each of the metal patches is substantially of the same shape,substantially of the same pattern, and substantially of the same size.The shape may be circular, square, rectangular, hexagon, octagon,elliptical, etc.; and the pattern may be a plate, a pattern withinterconnecting branches, an n^(th) order Peano curve, or an n^(th)order Hilbert curve.

A metal patch may be coupled to the metal backing 190 by one or moreconnectors 188 (e.g., vias). Alternatively, a metal patch may becapacitively coupled to the metal backing 190 (e.g., no vias).

The plurality of metal patches 186 is arranged in an array (e.g., 3×5 asshown). The array may be of a different size and shape. For example, thearray may be a square of n-by-n metal patches, where n is 2 or more. Asanother example, the array may be a series of concentric rings ofincreasing size and number of metal patches. As yet another example, thearray may be of a triangular shape, hexagonal shape, octagonal shape,etc.

FIG. 34 is a diagram of an embodiment of a projected artificial magneticmirror 184 on a single layer that includes a plurality of metal patches186. The metal patches 186 are substantially of the same shape,substantially of the same pattern, but of different sizes. The shape maybe circular, square, rectangular, hexagon, octagon, elliptical, etc.;and the pattern may be a plate, a pattern with interconnecting branches,an n^(th) order Peano curve, or an n^(th) order Hilbert curve.

A metal patch may be coupled to the metal backing 190 by one or moreconnectors 188 (e.g., vias). Alternatively, a metal patch may becapacitively coupled to the metal backing 190 (e.g., no vias).

The plurality of metal patches 186 is arranged in an array and thedifferent sized metal patches may be in various positions. For example,the larger sized metal patches may be on the outside of the array andthe smaller sized metal patches may be on the inside of the array. Asanother example, the larger and smaller metal patches may beinterspersed amongst each other. While two sizes of metal patches areshown, more sizes may be used.

FIG. 35 is a diagram of an embodiment of a projected artificial magneticmirror 184 on a single layer that includes a plurality of metal patches186. The metal patches are of different shapes, substantially of thesame pattern, and substantially of the same size. The shapes may becircular, square, rectangular, hexagon, octagon, elliptical, etc.; andthe pattern may be a plate, a pattern with interconnecting branches, ann^(th) order Peano curve, or an n^(th) order Hilbert curve.

A metal patch may be coupled to the metal backing 190 by one or moreconnectors 188 (e.g., vias). Alternatively, a metal patch may becapacitively coupled to the metal backing 190 (e.g., no vias).

The plurality of metal patches 186 is arranged in an array and thedifferent shaped metal patches may be in various positions. For example,the one type of shaped metal patches may be on the outside of the arrayand another type of shaped metal patches may be on the inside of thearray. As another example, the different shaped metal patches may beinterspersed amongst each other. While two different shapes of metalpatches are shown, more shapes may be used.

FIG. 36 is a diagram of an embodiment of a projected artificial magneticmirror 184 on a single layer that includes a plurality of metal patches186. The metal patches are of different shapes, substantially of thesame pattern, and of different sizes. The shapes may be circular,square, rectangular, hexagon, octagon, elliptical, etc.; and the patternmay be a plate, a pattern with interconnecting branches, an n^(th) orderPeano curve, or an n^(th) order Hilbert curve.

A metal patch may be coupled to the metal backing 190 by one or moreconnectors 188 (e.g., vias). Alternatively, a metal patch may becapacitively coupled to the metal backing 190 (e.g., no vias).

The plurality of metal patches 186 is arranged in an array and thedifferent shaped and sized metal patches may be in various positions.For example, the one type of shaped and sized metal patches may be onthe outside of the array and another type of shaped metal patches may beon the inside of the array. As another example, a different shaped andsized metal patches may be interspersed amongst each other.

As another alternative of the projected artificial magnetic mirror(PAMM) 184, the pattern of the metal patches may be varied. As such, thesize, shape, and pattern of the metal traces may be varied to achievedesired properties of the PAMM 184.

FIG. 37 is a diagram of an embodiment of a projected artificial magneticmirror 184 on a single layer that includes a plurality of metal patches192. The metal patches are of substantially the same size, substantiallyof the same modified Polya curve pattern, and substantially of the samesize. The shapes may be circular, square, rectangular, hexagon, octagon,elliptical, etc.; and the pattern may be a plate, a pattern withinterconnecting branches, an n^(th) order Peano curve, or an n^(th)order Hilbert curve.

A metal patch may be coupled to the metal backing 190 by one or moreconnectors 188 (e.g., vias). Alternatively, a metal patch may becapacitively coupled to the metal backing 190 (e.g., no vias).

The plurality of metal patches 192 is arranged in an array (e.g., 3×5 asshown). The array may be of a different size and shape. For example, thearray may be a square of n-by-n metal patches, where n is 2 or more. Asanother example, the array may be a series of concentric rings ofincreasing size and number of metal patches. As yet another example, thearray may be of a triangular shape, hexagonal shape, octagonal shape,etc.

As alternatives, the size and/or shape of the metal traces may bedifferent to achieve desired properties of the PAMM 184. As anotheralternative, the order, width, and/or scaling factor (s) of the modifiedPolya curve may be varied from one metal patch to another to achieve thedesired PAMM 184 properties.

FIGS. 38 a-38 e are diagrams of embodiments of an MPC (modified Polyacurve) metal trace having a constant width (w) and shaping factor (s)and varying order (n). In particular, FIG. 38 a illustrates a MPC metaltrace having a second order; FIG. 38 b illustrates a MPC metal tracehaving a third order; FIG. 38 c illustrates a MPC metal trace having afourth order; FIG. 38 d illustrates a MPC metal trace having a fifthorder; and FIG. 38 e illustrates a MPC metal trace having a sixth order.Note that higher order MPC metal traces may be used within the polygonalshape to provide the antenna structure.

FIGS. 39 a-39 c are diagrams of embodiments of an MPC (modified Polyacurve) metal trace having a constant width (w) and order (n) and avarying shaping factor (s). In particular, FIG. 39 a illustrates a MPCmetal trace having a 0.15 shaping factor; FIG. 39 b illustrates a MPCmetal trace having a 0.25 shaping factor; and FIG. 39 c illustrates aMPC metal trace having a 0.5 shaping factor. Note that MPC metal tracemay have other shaping factors to provide the antenna structure.

FIGS. 40 a and 40 b are diagrams of embodiments of an MPC (modifiedPolya curve) metal trace. In FIG. 40 a, the MPC metal trace is confinedin an orthogonal triangle shape and includes two elements: the shorterangular straight line and the curved line. In this implementation, theantenna structure is operable in two or more frequency bands. Forexample, the antenna structure may be operable in the 2.4 GHz frequencyband and the 5.5 GHz frequency band.

FIG. 40 b illustrates an optimization of the antenna structure of FIG.40 a. In this diagram, the straight-line trace includes an extensionmetal trace 194 and the curved line is shortened. In particular, theextension trace 194 and/or the shortening of the curved trace tune theproperties of the antenna structure (e.g., frequency band, bandwidth,gain, etc.).

FIGS. 41 a-41 h are diagrams of embodiments of polygonal shapes in whichthe modified Polya curve (MPC) trace may be confined. In particular,FIG. 41 a illustrates an Isosceles triangle; FIG. 41 b illustrates anequilateral triangle; FIG. 41 c illustrates an orthogonal triangle; FIG.41 d illustrates an arbitrary triangle; FIG. 41 e illustrates arectangle; FIG. 41 f illustrates a pentagon; FIG. 41 g illustrates ahexagon; and FIG. 41 h illustrates an octagon. Note that other geometricshapes may be used to confine the MPC metal trace (for example, acircle, an ellipse, etc.).

FIG. 42 is a diagram of an example of programmable metal patch that canbe programmed to have one or more modified Polya curves. Theprogrammable metal patch includes a plurality of smaller metal patchesarranged in an x-by-y matrix. Switching units positioned throughout thematrix receive control signals from a control module to couple thesmaller metal patches together to achieve a desired modified Polyacurve. Note that the smaller metal patches may be a continuous plate, apattern with interconnecting branches, an n^(th) order Peano curve, oran n^(th) order Hilbert curve.

In the present example, the programmable metal patch is configured tohave a third order modified Polya curve metal trace and a fourth ordermodified Polya curve metal trace. The configured metal traces may beseparate traces or coupled together. Note that the programmable metalpatch may be configured into other patterns (e.g., the continuous plate,a pattern with interconnecting branches, an n^(th) order Peano curve, oran n^(th) order Hilbert curve, etc.)

FIG. 43 is a diagram of an embodiment of an antenna having a projectedartificial magnetic mirror (PAMM) having modified Polya curve traces.The PAMM includes a 5-by-3 array of metal patches having a modifiedPolya curve pattern 196, of substantially the same size, and ofsubstantially the same shape. The antenna is a dipole antenna 198 of asize and shape for operation in the 60 GHz frequency band.

The radiating elements of the dipole antenna 198 are positioned over thePAMM 196 such that one or more connections can pass through the PAMM 196to couple the dipole antenna 198 to circuit elements on the other sideof the PAMM 196. In this example, the dipole antenna 198 is fabricatedon an outside layer of a die and/or package substrate and the PAMM 196is fabricated on an inner layer of the die and/or package substrate. Themetal backing of the PAMM (not shown) is on a lower layer with respectto the array of metal patches.

FIG. 44 is a diagram of another embodiment of a projected artificialmagnetic mirror 184 on a single layer that includes a plurality of coils200. Each of the coils is substantially of the same size, shape, length,and number of turns. The shape may be circular, square, rectangular,hexagon, octagon, elliptical, etc. Note that a coil may be coupled tothe metal backing 190 by one or more connectors 188 (e.g., vias).Alternatively, a coil may be capacitively coupled to the metal backing190 (e.g., no vias). In a specific embodiment, the length of a coil maybe less than or equal to ½ wavelength of the desired frequency band ofthe PAMM 184 (i.e., the frequency band in which surface waves andcurrents do not propagate and the tangential magnetic is small).

The plurality of coils 200 is arranged in an array (e.g., 3×5 as shown).The array may be of a different size and shape. For example, the arraymay be a square of n-by-n coils, where n is 2 or more. As anotherexample, the array may be a series of concentric rings of increasingsize and number of coils. As yet another example, the array may be of atriangular shape, hexagonal shape, octagonal shape, etc.

FIG. 45 is a cross sectional diagram of an embodiment of a projectedartificial magnetic mirror that includes a plurality of coils 202, themetal backing 204, and one or more dielectrics 206. Each of the coils iscoupled to the metal backing 204 by one or more vias and is a distance“d” from the metal backing 204. The one or more dielectrics 206 arepositioned between the metal backing 204 and the coils 202. Thedielectric 206 may be a dielectric layer of a die and/or of a packagesubstrate. Alternatively, the dielectric 206 may be injected between themetal backing 204 and the coils 202. While FIG. 45 references the coils202 for forming a projected artificial magnetic mirror (PAMM), thecross-sectional view is applicable to any of the other embodiments ofthe PAMM previously discussed or to be subsequently discussed.

FIG. 46 is a schematic block diagram of the embodiment of the projectedartificial magnetic mirror of FIG. 45. In this diagram, each coil isrepresented as an inductor and the capacitance between the coils 202 isrepresented as capacitors whose capacitance is based on the distance “d”between the coils and the metal backing, the distance between the coils,the size of the coils, and the properties of the dielectric 206. Theconnection from a coil to the metal backing may be done at a tap of theinductor, which may be positioned at one or more locations on the coil.

As illustrated, the PAMM is a distributed inductor-capacitor networkthat can be configured to achieve the various frequency responses shownin one or more of FIGS. 1-15. For instance, the size of the coils may bevaried to achieve a desired inductance. Further, the distance betweenthe inductors may be varied to adjust the capacitance therebetween.Thus, by adjusting the inductance and/or capacitance along thedistributed inductor capacitor network, one or more desired propertiesof the PAMM (e.g., amplifier, bandpass, band gap, electric wall,magnetic wall, etc.) within a desired frequency band may be obtained.

FIG. 47 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror that includes a plurality of coils202, the metal backing 204, and one or more dielectrics 206. One or moredielectrics 206 are positioned between the metal backing 204 and thecoils 202. The dielectric 206 may be a dielectric layer of a die and/orof a package substrate. Alternatively, the dielectric 206 may beinjected between the metal backing 204 and the coils 202. Note that thecoils 202 are not coupled to the metal backing 204 by vias. While FIG.47 references the coils 202 for forming a projected artificial magneticmirror (PAMM), the cross-sectional view is applicable to any of theother embodiments of the PAMM previously discussed or to be subsequentlydiscussed.

FIG. 48 is a schematic block diagram of the embodiment of the projectedartificial magnetic mirror of FIG. 47. In this diagram, each coil isrepresented as an inductor, the capacitance between the coils 202 isrepresented as capacitors, and the capacitance between the coils and themetal backing are also represented as capacitors.

As illustrated, the PAMM is a distributed inductor-capacitor networkthat can be configured to achieve the various frequency responses shownin one or more of FIGS. 1-15. For instance, the size of the coils may bevaried to achieve a desired inductance. Further, the distance betweenthe inductors (and/or the distance between a coil and the metal backing)may be varied to adjust the capacitance therebetween. Thus, by adjustingthe inductance and/or capacitance along the distributed inductorcapacitor network, one or more desired properties of the PAMM (e.g.,amplifier, bandpass, band gap, electric wall, magnetic wall, etc.)within a desired frequency band may be obtained.

FIG. 49 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror that combines the embodiments ofFIGS. 45 and 47. In particular, some of the coils 202 are coupled to themetal backing 204 by a via, while others are not. While FIG. 49references the coils 202 for forming a projected artificial magneticmirror (PAMM), the cross-sectional view is applicable to any of theother embodiments of the PAMM previously discussed or to be subsequentlydiscussed.

FIG. 50 is a schematic block diagram of another embodiment of theprojected artificial magnetic mirror of FIG. 49. In this diagram, eachcoil is represented as an inductor, the capacitance between the coils isrepresented as capacitors, and the capacitance between the coils and themetal backing are also represented as capacitors. As is further shown,some of the coils are directly coupled to the metal backing by aconnection (e.g., a via) and other coils are capacitively coupled to themetal backing.

As illustrated, the PAMM is a distributed inductor-capacitor networkthat can be configured to achieve the various frequency responses shownin one or more of FIGS. 1-15. For instance, the size of the coils 202may be varied to achieve a desired inductance. Further, the distancebetween the inductors (and/or the distance between a coil and the metalbacking) may be varied to adjust the capacitance therebetween. Thus, byadjusting the inductance and/or capacitance along the distributedinductor capacitor network, one or more desired properties of the PAMM(e.g., amplifier, bandpass, band gap, electric wall, magnetic wall,etc.) within a desired frequency band may be obtained.

FIG. 51 is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror that includes a plurality of coils208-210, the metal backing 204, and one or more dielectrics 206. A firstplurality of the coils 208 is on a first layer and a second plurality ofcoils 210 is on a second layer. Each of the coils is coupled to themetal backing 204 by one or more vias. The one or more dielectrics 206are positioned between the metal backing 204 and the coils. Thedielectric 206 may be a dielectric layer of a die and/or of a packagesubstrate. Alternatively, the dielectric 206 may be injected between themetal backing 204 and the coils.

This embodiment of the PAMM creates a more complex distributedinductor-capacitor network since capacitance is also formed between thelayers of coils. The inductors and/or capacitors of the distributedinductor-capacitor network can be adjusted to achieve the variousfrequency responses shown in one or more of FIGS. 1-15. For instance,the size of the coils may be varied to achieve a desired inductance.Further, the distance between the inductors, the distance between thelayers, and/or the distance between a coil and the metal backing may bevaried to adjust the capacitance therebetween. Thus, by adjusting theinductance and/or capacitance along the distributed inductor capacitornetwork, one or more desired properties of the PAMM (e.g., amplifier,bandpass, band gap, electric wall, magnetic wall, etc.) within a desiredfrequency band may be obtained.

While FIG. 51 references the coils for forming a projected artificialmagnetic mirror (PAMM), the cross-sectional view is applicable to any ofthe other embodiments of the PAMM previously discussed or to besubsequently discussed. Further, while each coil is shown to have aconnection to the metal backing 204, some or all of the coils may nothave a connection to the metal backing as shown in FIGS. 47 and 49.

FIG. 52 is a diagram of an embodiment of an antenna having a projectedartificial magnetic mirror 212 that includes spiral traces (e.g.,coils). The PAMM 212 includes a 5-by-3 array of coils of substantiallythe same size, of substantially the same length, of substantially thesame number of turns, and of substantially the same shape. The antennais a dipole antenna 214 of a size and shape for operation in the 60 GHzfrequency band.

The radiating elements of the dipole antenna 214 are positioned over thePAMM 212 such that one or more connections can pass through the PAMM 212to couple the dipole antenna 214 to circuit elements on the other sideof the PAMM 212. In this example, the dipole antenna 214 is fabricatedon an outside layer of a die and/or package substrate and the PAMM 212is fabricated on an inner layer of the die and/or package substrate. Themetal backing of the PAMM 212 (not shown) is on a lower layer withrespect to the array of metal patches.

FIG. 53 is a diagram of an example radiation pattern of a concentricspiral coil (e.g., symmetrical about a center point). In the presence ofan external electromagnetic field (e.g., a transmitted RF and/or MMWsignal), the coil functions as an antenna with a radiation pattern thatis normal to its x-y plane 216. As such, when a concentric coil isincorporated into a projected artificial magnetic mirror (PAMM) 218, itreflects electromagnetic energy in accordance with its radiationpattern. For example, when an electromagnetic signal is received at anangle of incidence, the concentric coil, as part of the PAMM 218, willreflect the signal at the corresponding angle of reflection (i.e., theangle of reflection equals the angle of incidence).

FIG. 54 is a diagram of an example radiation pattern of a projectedartificial magnetic mirror having a plurality of concentric spiral coils220. As discussed with reference to FIG. 53, the radiation pattern of aconcentric spiral coil is normal to its x-y plane. Thus, an array ofconcentric spiral coils 220 will produce a composite radiation patternthat is normal to its x-y plane, which causes the array to function likea mirror for electromagnetic signals (in the frequency band of thePAMM).

FIG. 55 is a diagram of an example radiation pattern of a conventionaldipole antenna 224. As shown, a dipole antenna 224 has a forwardradiation pattern 226 and an image radiation pattern 228 that are normalto the plane of the antenna 224. When in use, the antenna 224 ispositioned, when possible, such that received signals are within theforward radiation pattern 226, where the gain of the antenna is at itslargest.

FIG. 56 is a diagram of an example radiation pattern of a dipole antenna230 with a projected artificial magnetic mirror (PAMM) 232. In thisexample, the forward radiation pattern 236 is similar to the forwardradiation pattern 226 of FIG. 55. The image radiation pattern 234,however, is reflected off of the PAMM 232 into the same direction as theforward radiation pattern 236. While blocking signals on the other sideof it, the PAMM 232 increases the gain of the antenna 230 for signals onthe antenna side of the PAMM 232 by 3 dB or more due to the reflectionof the image radiation pattern 234.

FIG. 57 is a diagram of an example radiation pattern 240 of an eccentricspiral coil 238 (e.g., asymmetrical about a center point). In thepresence of an external electromagnetic field (e.g., a transmitted RFand/or MMW signal), the eccentric spiral coil 238 functions as anantenna with a radiation pattern 240 that is offset from normal to itsx-y plane. The angle of offset (e.g., θ) is based on the amount ofasymmetry of the spiral coil 238. In general, the greater the asymmetryof the spiral coil 238, the greater its angle of offset will be.

When an eccentric spiral coil 238 is incorporated into a projectedartificial magnetic mirror (PAMM), it reflects electromagnetic energy inaccordance with its radiation pattern 240. For example, when anelectromagnetic signal is received at an angle of incidence, theeccentric spiral coil 238, as part of the PAMM, will reflect the signalat the corresponding angle of reflection plus the angle of offset (i.e.,the angle of reflection equals the angle of incidence plus the angle ofoffset, which will asymptote parallel to the x-y plane).

FIG. 58 is a diagram of an example radiation pattern of a projectedartificial magnetic mirror (PAMM) having some eccentric and concentricspiral coils 242. The concentric spiral coils 246 have a normalradiation pattern as discussed with reference to FIG. 53 and theeccentric spiral coils 244 have an offset radiation pattern as shown inFIG. 57. With a combination of eccentric and concentric spiral coils242, a focal point is created at some distance from the surface of thePAMM. The focus of the focal point (e.g., its relative size) and itsdistance from the surface of the PAMM is based on the angle of offset ofeccentric spiral coils 244, the number of concentric spiral coils 246,the number of the eccentric spiral coils 246, and the positioning ofboth types of spiral coils.

FIG. 59 is a diagram of another example radiation pattern of a projectedartificial magnetic mirror (PAMM) having a first type of eccentricspiral coils 250, a second type of eccentric spiral coils 252, andconcentric spiral coils 246. The concentric spiral coils 246 have anormal radiation pattern as discussed with reference to FIG. 53 and theeccentric spiral coils 250-252 have an offset radiation pattern as shownin FIG. 57. The first type of eccentric spiral coils 250 has a firstangle of offset and the second type of eccentric spiral coils 252 has asecond angle of offset. In the present example, the second angle ofoffset is greater than the first.

With a combination of eccentric and concentric spiral coils 242, a focalpoint is created at some distance from the surface of the PAMM. Thefocus of the focal point (e.g., its relative size) and its distance fromthe surface of the PAMM is based on the angle of offset of eccentricspiral coils 250-252, the number of concentric spiral coils 246, thenumber of the eccentric spiral coils 250-252, and the positioning ofboth types of spiral coils.

While this example shows two types of eccentric spiral coils 250-252,more than two types can be used. The number of types of eccentric spiralcoils 250-252 is at least partially dependent on the application. Forinstance, an antenna application may optimally be fulfilled with two ormore types of eccentric spiral coils 250-252.

FIG. 60 is a diagram of a projected artificial magnetic mirror (PAMM)having a first type of eccentric spiral coils, a second type ofeccentric spiral coils, and concentric spiral coils. The concentricspiral coils have a normal radiation pattern as discussed with referenceto FIG. 53 and the eccentric spiral coils have an offset radiationpattern as shown in FIG. 57. The first type of eccentric spiral coilshas a first angle of offset and the second type of eccentric spiralcoils has a second angle of offset. In the present example, the secondangle of offset is greater than the first.

As shown, the overall shape of the PAMM is circular (but could be anoval, a square, a rectangle, or other shape), where the concentricspiral coils are of a pattern and in the center. The first type ofeccentric spiral coils have a corresponding pattern and encircles (atleast partially) the concentric spiral coils, which, in turn, isencircled (at least partially) by the second type of eccentric spiralcoils that have a second corresponding pattern.

Note that, while FIGS. 53-60 show the coils coupled to the metal backingby a via, one or more of the coils may be capacitively coupled to themetal backing as previously discussed. As such, the PAMM of eccentricspiral coils and concentric spiral coils may have a similar connectionpattern to the metal backing as shown in FIGS. 47 and 49.

FIG. 61 is a diagram of an embodiment of an effective dish antenna 254that includes one or more antennas 256 and a plurality of coils 258 thatform a projected artificial magnetic mirror (PAMM). The PAMM may besimilar to that of FIG. 60, where it includes two type of eccentricspiral coils 250-252 encircling concentric spiral coils 246. The one ormore antennas 256 is positioned within the focal point 260 of the PAMM.In this manner, the PAMM functions as a dish for the antenna 256,focusing energy of an electromagnetic signal at the focal point 260. Assuch, a dish antenna is realized from a substantially flat structure.

The effective dish antenna 254 may be constructed for a variety offrequency ranges. For instance, the effective dish antenna 254 may befabricated on a die and/or package substrate for use in a 60 GHzfrequency band. Alternatively, the plurality of spiral coils 258 may bediscrete components designed for operation in the C-band of 500 MHz to 1GHz and/or in the K-band of 12 GHz to 18 GHz (e.g., satellite televisionand/or radio frequency bands). As yet another example, the effectivedish 254 may be used in the 900 MHz frequency band, the 1800-1900 MHzfrequency band, the 2.4 GHz frequency band, the 5 GHz frequency band,and/or any other frequency band used for RF and/or MMW communications.

FIG. 62 is a diagram of another embodiment of an effective dish antenna264 that includes one or more antennas 256, a plurality of concentricspiral coils 246, and multiple types of eccentric spiral coils 250, 252,266. In this embodiment, the focal point is 260 off-center based on theimbalance of the various types of eccentric spiral coils 250, 252, 266.As shown, only the first type of eccentric spiral coils 250 is shown tothe right of the concentric spiral coils 246. To the left of concentricspiral coils 246 are the second type of spiral coils 252 and a thirdtype of spiral coils 266. The third type of spiral coils 254 has a thirdangle of offset, which is larger than the second angle of offset.

The imbalance of eccentric spiral coils rotates the effective dish 254with respect to the embodiment of FIG. 61. As such, the effective dish264 is configured to have a particular angle of reception/transmission.

FIG. 63 is a diagram of an embodiment of an effective dish antenna array268 that includes a plurality of effective dish antennas 254, 264. Inthis example, the array of effective dish antennas 268 includeseffective dish antennas 254, 264 of FIGS. 61 and 62. Alternatively, thearray 268 may include effective dish antennas of FIG. 61 only or of FIG.62 only. As another alternative, the array may include different typesof effective dish antennas than the examples of FIGS. 61 and 62.

The array of effective dish antennas 268 may have a linear shape asshown in FIG. 63, may have a circular shape, may have an oval shape, mayhave a square shape, may have a rectangular shape, or may have any othershape. For non-linear shapes (e.g., a circle), the effective dishantenna of FIG. 612 254 may be in the center of the circle, which issurrounded by effective dish antennas of FIG. 622 264.

FIG. 64 is a diagram of an example application of an effective dishantenna array. In this example, one or more effective dish antennasand/or one or more effective dish antenna arrays 272 are mounted on oneor more parts of a vehicle (e.g., car, truck, bus, etc.). Alternatively,the effective antenna dish(es) and/or array(s) 272 may be integratedinto the vehicle part. For example, a plastic rear fender of a car mayhave an effective dish array fabricated therein. As another example, theroof of a car may have an effective dish array fabricated therein.

For vehicle applications, the size of the effective dish antenna and/orarray 272 will vary depending on the frequency band of the particularapplication. For example, for 60 GHz applications, the effective dishantenna and/or array 272 may be implemented on an integrated circuit. Asanother example, for satellite communications, the effective dishantenna and/or array 272 will be based on the wavelength of thesatellite signal.

As another example, a vehicle may be equipped with multiple effectivedish antennas and/or arrays 272. In this example, one dish antenna orarray may be for a first frequency band and a second dish and/or arraymay be for a second frequency band.

FIG. 65 is a diagram of another example application of an effective dishantenna array. In this example, one or more effective dish antennasand/or one or more effective dish antenna arrays 272 are mounted on abuilding 274 (e.g., a home, an apartment building, an office building).Alternatively, the effective antenna dish(es) and/or array(s) 272 may beintegrated into non-conductive exterior material of the building. Forexample, roofing material may have an effective dish array fabricatedtherein. As another example, siding material may have an effective disharray fabricated therein. As another example, wall, ceiling, and/orflooring material may have an effective dish array fabricated therein.

For building applications, the size of the effective dish antenna and/orarray 272 will vary depending on the frequency band of the particularapplication. For example, for 60 GHz applications, the effective dishantenna and/or array 272 may be implemented on an integrated circuit. Asanother example, for satellite communications, the effective dishantenna and/or array 272 will be based on the wavelength of thesatellite signal.

As another example, a building 274 may be equipped with multipleeffective dish antennas and/or arrays. In this example, one dish antennaor array may be for a first frequency band and a second dish and/orarray may be for a second frequency band. In furtherance of thisexample, the effective flat dishes may be used for antennas of a basestation for supporting cellular communications and/or for antennas of anaccess point of a wireless local area network.

FIG. 66 is a diagram of an example of an adjustable coil 276 for use ina projected artificial magnetic mirror (PAMM). The adjustable coil 276includes an inner winding section 278, an outer winding section 280, andcoupling circuitry 282 (e.g., MEMs switches, RF switches, etc.). Thewinding sections 278-280 may each include one or more turns and have thesame length and/or width or different lengths and/or widths.

To adjust the characteristics of the coil 276 (e.g., its inductance, itsreactance, its resistance, its capacitive coupling to other coils and/orto the metal backing), the winding sections 278-280 may be coupled inparallel (as shown in FIG. 68), coupled in series (as shown in FIG. 67),or used as separate coils.

With in the inclusion of adjustable coils, a PAMM may be adjusted tooperate in different frequency bands. For instance, in a multi-modecommunication device that operates in two frequency bands, the PAMM ofan antenna structure (or other circuit structure [e.g., transmissionline, filter, inductor, etc.]) is adjusted to correspond to thefrequency band currently being used by the communication device.

FIG. 69 is a cross sectional diagram of an example of an adjustable coilfor use in a projected artificial magnetic mirror (PAMM). As shown, thewinding sections 286 are on one layer and the coupling circuit 282 is ona second layer. The layers are coupled together by gatable vias 284. Forexample, the coupling circuit 282 may include MEMS switches and/or RFswitches that, for parallel coupling, couples the winding sections 286together by enabling a plurality of gatable vias 284. As an example ofseries connection, the coupling circuit 282 enables one or a few gatablevias 284 near respective ends of the winding sections 286 to couple themtogether.

FIG. 70 is a cross sectional diagram of another example of an adjustablecoil for use in a projected artificial magnetic mirror (PAMM). Thisembodiment is similar to that of FIG. 69 with the exception of theinclusion of parallel winding sections 288 (e.g., mirror images of thewinding section of FIG. 66, but on a different layer). As such, thecoupling circuit 282 can couple the parallel winding sections 288 to thewinding sections 286 on the upper layer to reduce the resistance,inductance, and/or reactance of the winding sections.

FIG. 71 is a schematic block diagram of a projected artificial magneticmirror having adjustable coils 290. In this example, each of theadjustable coils 290 has two winding sections (L1 and L2), threeswitches (S1-S3), and selectable tap switches 292. For a seriesconnection of the winding sections, S1 is closed and S2 and S3 are open.For a parallel connection, S1 is open and S2 and S3 are closed. For twocoil applications, all three switches are open.

To adjust the coupling to the metal backing, the selectable tap switches292 may be open, thus enabling capacitive coupling to the metal backing.Alternatively, one or both of the selectable tap switches may be closedto adjust the inductor-capacitor circuit of the coil. Further, eachwinding section may have more than one tap, which further enables tuningof the inductor-capacitor circuit of the coil.

FIG. 72 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror (PAMM). In this embodiment, theadjustable coil includes a plurality of metal segments and a pluralityof switching elements (e.g., transistors, MEMS switches, RF switches,etc.) that enable the coil to be configured as a concentric spiral coil(as shown in FIG. 74); as a first eccentric spiral coil (as shown inFIG. 73); or as a second eccentric spiral coil as shown in the presentfigure.

With programmable coils, the PAMM can be programmed to provide a flatdish (e.g., as shown in FIG. 54), a first type of effective dish (e.g.,as shown in FIG. 61), and/or a second type of effective dish (e.g., asshown in FIG. 62). Thus, as the application for an effective dishantenna changes, the PAMM can be programmed to accommodate the changesin application.

FIG. 75 is a diagram of another example of an adjustable coil for use ina projected artificial magnetic mirror (PAMM). The adjustable coilincludes a plurality of small metal patches arranged in an x-by-ymatrix. Switching units positioned throughout the matrix receive controlsignals from a control module to couple the small metal patches togetherto achieve a desired spiral coil. Note that the small metal patches maybe a continuous plate, a pattern with interconnecting branches, ann^(th) order Peano curve, or an n^(th) order Hilbert curve.

In the present example, the adjustable coil is configured into aneccentric spiral coil. In the example of FIG. 76, the adjustable coil isconfigured into a concentric spiral coil. Note that the adjustable coilmay be configured into other coil patterns (e.g., circular spiral,elliptical, etc.).

FIG. 77 is a diagram of an embodiment of an adjustable effective dishantenna array 294 that includes one or more antennas 296 and a pluralityof adjustable coils 298 that form a projected artificial magnetic mirror(PAMM). In the present example, the shape of the effective dish 294 maybe changed. Alternatively, the focal point 300 of the effective dish 294may be changed. The particular configuration of the adjustable effectivedish antenna 294 will be driven by a present application. A control unitinterprets the present application and generates control signals toconfigure the adjustable effective dish antenna 294 as desired.

FIG. 78 is a diagram of an embodiment of flip-chip connection betweentwo die. The first die 304 includes one or more antennas 304 andprojected artificial magnetic mirror (PAMM) 308. The second die 310includes one or more circuit components 312 (e.g., LNA, PA, etc.). Themetal plating 314 may be on the bottom surface of the first die 304 oron the top of the second die 310. In either case, the metal plating 314provides the metal backing for the PAMM 308.

To coupling the first die 304 to the second 310, interfaces are providedin the metal plating to allow in-band communication between theantenna(s) 306 and one or more of the circuit components 312. Thecoupling 314 may also include conventional flip-chip coupling technologyto facilitate electrical and/or mechanical coupling of the first die 304to the second 310.

FIG. 79 is a schematic block diagram of an embodiment of communicationdevices 316 communicating using electromagnetic communications 318(e.g., near field communication [NFC]). Each of the communicationdevices 316 includes a baseband processing module 320, a transmittersection 322, a receiver section 324, and an NFC coil structure 326(e.g., a wireless communication structure). The NFC coil structure 326will be described in greater detail with reference to one or more ofFIGS. 80-86. Note that a communication device 316 may be a cellulartelephone, a wireless local area network (WLAN) client, a WLAN accesspoint, a computer, a video game console and/or player unit, etc.

The baseband processing module 320 may be implemented via a processingmodule that may be a single processing device or a plurality ofprocessing devices. Such a processing device may be a microprocessor,micro-controller, digital signal processor, microcomputer, centralprocessing unit, field programmable gate array, programmable logicdevice, state machine, logic circuitry, analog circuitry, digitalcircuitry, and/or any device that manipulates signals (analog and/ordigital) based on hard coding of the circuitry and/or operationalinstructions. The processing module may have an associated memory and/ormemory element, which may be a single memory device, a plurality ofmemory devices, and/or embedded circuitry of the processing module. Sucha memory device may be a read-only memory, random access memory,volatile memory, non-volatile memory, static memory, dynamic memory,flash memory, cache memory, and/or any device that stores digitalinformation. Note that if the processing module includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that when the processing module implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element stores, and the processing module executes,hard coded and/or operational instructions corresponding to at leastsome of the steps and/or functions illustrated in FIGS. 79-87.

In an example of operation, one of the communication devices 316 hasdata (e.g., voice, text, audio, video, graphics, etc.) to transmit tothe other communication device 316. In this instance, the basebandprocessing module 320 receives the data (e.g., outbound data) andconverts it into one or more outbound symbol streams in accordance withone or more wireless communication standards (e.g., RFID, ISO/IEC 14443,ECMA-34, ISO/IEC 18092, near field communication interface and protocol1 & 2 [NFCIP-1 & NFCIP-2]). Such a conversion includes one or more of:scrambling, puncturing, encoding, interleaving, constellation mapping,modulation, frequency spreading, frequency hopping, beamforming,space-time-block encoding, space-frequency-block encoding, frequency totime domain conversion, and/or digital baseband to intermediatefrequency conversion. Note that the baseband processing module 320converts the outbound data into a single outbound symbol stream forSingle Input Single Output (SISO) communications and/or for MultipleInput Single Output (MISO) communications and converts the outbound datainto multiple outbound symbol streams for Single Input Multiple Output(SIMO) and Multiple Input Multiple Output (MIMO) communications.

The transmitter section 322 converts the one or more outbound symbolstreams into one or more outbound signals that has a carrier frequencywithin a given frequency band (e.g., 2.4 GHz, 5 GHz, 57-66 GHz, etc.).In an embodiment, this may be done by mixing the one or more outboundsymbol streams with a local oscillation to produce one or moreup-converted signals. One or more power amplifiers and/or poweramplifier drivers amplifies the one or more up-converted signals, whichmay be bandpass filtered, to produce the one or more outbound signals.In another embodiment, the transmitter section 322 includes anoscillator that produces an oscillation. The outbound symbol stream(s)provides phase information (e.g., +/−Δθ [phase shift] and/or θ(t) [phasemodulation]) that adjusts the phase of the oscillation to produce aphase adjusted signal(s), which is transmitted as the outboundsignal(s). In another embodiment, the outbound symbol stream(s) includesamplitude information (e.g., A(t) [amplitude modulation]), which is usedto adjust the amplitude of the phase adjusted signal(s) to produce theoutbound signal(s).

In yet another embodiment, the transmitter section 322 includes anoscillator that produces an oscillation(s). The outbound symbolstream(s) provides frequency information (e.g., +/−Δf [frequency shift]and/or f(t) [frequency modulation]) that adjusts the frequency of theoscillation to produce a frequency adjusted signal(s), which istransmitted as the outbound signal(s). In another embodiment, theoutbound symbol stream(s) includes amplitude information, which is usedto adjust the amplitude of the frequency adjusted signal(s) to producethe outbound signal(s). In a further embodiment, the transmitter section322 includes an oscillator that produces an oscillation(s). The outboundsymbol stream(s) provides amplitude information (e.g., +/−ΔA [amplitudeshift] and/or A(t) [amplitude modulation) that adjusts the amplitude ofthe oscillation(s) to produce the outbound signal(s).

The NFC coil structure 326 receives the one or more outbound signals,converts it into an electromagnetic signal(s) and transmits theelectromagnetic signal(s). The NFC coil 326 structure of the othercommunication devices receives the one or more electromagnetic signals,converts it into an inbound electrical signal(s) and provides theinbound electrical signal(s) to the receiver section 324.

The receiver section 324 amplifies the one or more inbound signals toproduce one or more amplified inbound signals. The receiver section 324may then mix in-phase (I) and quadrature (Q) components of the amplifiedinbound signal(s) with in-phase and quadrature components of a localoscillation(s) to produce one or more sets of a mixed I signal and amixed Q signal. Each of the mixed I and Q signals are combined toproduce one or more inbound symbol streams. In this embodiment, each ofthe one or more inbound symbol streams may include phase information(e.g., +/−Δθ [phase shift] and/or θ(t) [phase modulation]) and/orfrequency information (e.g., +/−Δf [frequency shift] and/or f(t)[frequency modulation]). In another embodiment and/or in furtherance ofthe preceding embodiment, the inbound signal(s) includes amplitudeinformation (e.g., +/−ΔA [amplitude shift] and/or A(t) [amplitudemodulation]). To recover the amplitude information, the receiver sectionincludes an amplitude detector such as an envelope detector, a low passfilter, etc.

The baseband processing module 320 converts the one or more inboundsymbol streams into inbound data (e.g., voice, text, audio, video,graphics, etc.) in accordance with one or more wireless communicationstandards (e.g., RFID, ISO/IEC 14443, ECMA-34, ISO/IEC 18092, near fieldcommunication interface and protocol 1 & 2 [NFCIP-1 & NFCIP-2]). Such aconversion may include one or more of: digital intermediate frequency tobaseband conversion, time to frequency domain conversion,space-time-block decoding, space-frequency-block decoding, demodulation,frequency spread decoding, frequency hopping decoding, beamformingdecoding, constellation demapping, deinterleaving, decoding,depuncturing, and/or descrambling. Note that the baseband processingmodule 320 converts a single inbound symbol stream into the inbound datafor Single Input Single Output (SISO) communications and/or for MultipleInput Single Output (MISO) communications and converts the multipleinbound symbol streams into the inbound data for Single Input MultipleOutput (SIMO) and Multiple Input Multiple Output (MIMO) communications.

FIG. 80 is a diagram of an embodiment of an integrated circuit (IC) 328that includes a package substrate 330 and a die 332. The die 332includes a baseband processing module 334, a transceiver 336, and one ormore NFC coils 338. Such an IC 328 may be used in the communicationdevices of FIG. 79 and/or for other wireless communication devices.

FIG. 81 is a diagram of an embodiment of an integrated circuit (IC) 328that includes a package substrate 330 and a die 332. This embodiment issimilar to that of FIG. 80 except that one NFC coil structure 342 is onthe package substrate 330 (another is on the die). Accordingly, IC 328includes a connection from the NFC coil 342 structure on the packagesubstrate 330 to the transceiver 336 on the die 332.

FIG. 82 is a diagram of an embodiment of an integrated circuit (IC) 328that includes a package substrate 330 and a die 332. This embodiment issimilar to that of FIG. 80 except that both NFC coil structures 342 areon the package substrate 330. Accordingly, IC 328 includes connectionsfrom the NFC coil structures 342 on the package substrate 330 to thetransceiver 336 on the die 332.

In the various embodiments of the NFC coil structure of FIGS. 79-82, anNFC coil structure may include one or more coils that is sized for thegiven type and frequency of the NFC communication. For example, 60 GHzNFC communication allows for the NFC coil(s) to be on the die, while 2.4GHz and 5 GHz NFC communications typically requires the NFC coils to beon the package substrate 330, and/or on the substrate supporting the IC328 (e.g., on the PCB).

FIG. 83 is a cross sectional diagram of an embodiment of an NFC coilstructure that is implemented on one or more layers of a die 346 of anintegrated circuit (IC). The die 346 includes a plurality of layers 348and may be of a CMOS fabrication process, a Gallium Arsenide fabricationprocess, or other IC fabrication process. In this embodiment, one ormore coils 344 are fabricated as one or more metal traces of aparticular length and shape based on the desired coil properties (e.g.,frequency band, bandwidth, impedance, quality factor, etc.) of thecoil(s) on an outer layer of the die 346.

On an inner layer, which is a distance “d” from the layer supporting thecoil(s) 344, a projected artificial magnetic mirror (PAMM) 350 isfabricated. The PAMM 350 may be fabricated in one of a plurality ofconfigurations as discussed with reference to one or more of FIGS.33-63. The PAMM 350 may be electrically coupled to a metal backing 354(e.g., ground plane) of the die 346 by one or more vias 352.Alternatively, the PAMM 350 may capacitively coupled to the metalbacking 354 (i.e., is not directly coupled to the metal backing 354 by avia 352, but through the capacitive coupling of the metal elements ofthe PAMM 350 and the metal backing 354).

The PAMM 350 functions as an electric field reflector for the coil(s)344 within a given frequency band. In this manner, circuit components356 (e.g., the baseband processor, the components of the transmittersection and receiver section, etc.) fabricated on other layers of thedie 346 are substantially shielded from the electromagnetic energy ofthe coil(s) 344. In addition, the reflective nature of the PAMM 350 mayimprove the gain of the coil(s) 344.

FIG. 84 is a diagram of an embodiment of an NFC coil structure that isimplemented on one or more layers of a package substrate 360 of anintegrated circuit (IC). The package substrate 360 includes a pluralityof layers 362 and may be a printed circuit board or other type ofsubstrate. In this embodiment, one or more coils 358 are fabricated asone or more metal traces of a particular length and shape based on thedesired coil properties of the coil(s) on an outer layer of the packagesubstrate 360.

On an inner layer of the package substrate 360, a projected artificialmagnetic mirror (PAMM) 364 is fabricated. The PAMM 364 may be fabricatedin one of a plurality of configurations as discussed with reference toone or more of FIGS. 33-63. The PAMM 364 may be electrically coupled toa metal backing 368 (e.g., ground plane) of the die 370 by one or morevias 366. Alternatively, the PAMM 364 may capacitively coupled to themetal backing 368.

FIG. 85 is a diagram of an embodiment of an NFC coil structure that issimilar to the NFC coil structure of FIG. 83 with the exception that thecoil(s) 372 are fabricated on two or more layers of the die 346. Thedifferent layers of the coil 372 may be coupled in a series mannerand/or in a parallel manner to achieve the desired properties (e.g.,frequency band, bandwidth, impedance, quality factor, etc.) of thecoil(s) 372.

FIG. 86 is a diagram of an embodiment of an NFC coil structure that issimilar to the NFC coil structure of FIG. 84 with the exception that thecoil(s) 374 are fabricated on two or more layers of the packagesubstrate 360. The different layers 362 of the coil 374 may be coupledin a series manner and/or in a parallel manner to achieve the desiredproperties (e.g., frequency band, bandwidth, impedance, quality factor,etc.) of the coil(s).

FIG. 87 is a schematic block diagram of an embodiment of a radar system376 that includes one or more radar devices 1-R, and a processing module378. The radar system 376 may be fixed or portable. For example, theradar system 376 may be in the fixed configuration when it detectsplayer movements of a gaming system in a room. In another example, theradar system 376 may be in the portable configuration when it detectsvehicles around a vehicle equipped with the radar system 376. Fixedradar system applications also include radar for weather, control towerbased aircraft tracking, manufacturing line material tracking, andsecurity system motion sensing. Portable radar system applications alsoinclude vehicular safety applications (e.g., collision warning,collision avoidance, adaptive cruise control, lane departure warning),aircraft based aircraft tracking, train based collision avoidance, andgolf cart based golf ball tracking.

Each of the radar devices 1-R includes an antenna structure 380 thatincludes a projected artificial magnetic mirror (PAMM) as previouslydescribed, a shaping module 382, and a transceiver module 384. Theprocessing module 378 may be a single processing device or a pluralityof processing devices. Such a processing device may be a microprocessor,micro-controller, digital signal processor, microcomputer, centralprocessing unit, field programmable gate array, programmable logicdevice, state machine, logic circuitry, analog circuitry, digitalcircuitry, and/or any device that manipulates signals (analog and/ordigital) based on hard coding of the circuitry and/or operationalinstructions. The processing module 378 may have an associated memoryand/or memory element, which may be a single memory device, a pluralityof memory devices, and/or embedded circuitry of the processing module378. Such a memory device may be a read-only memory, random accessmemory, volatile memory, non-volatile memory, static memory, dynamicmemory, flash memory, cache memory, and/or any device that storesdigital information. Note that if the processing module 378 includesmore than one processing device, the processing devices may be centrallylocated (e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that when the processing module 378 implements one or moreof its functions via a state machine, analog circuitry, digitalcircuitry, and/or logic circuitry, the memory and/or memory elementstoring the corresponding operational instructions may be embeddedwithin, or external to, the circuitry comprising the state machine,analog circuitry, digital circuitry, and/or logic circuitry. Stillfurther note that, the memory element stores, and the processing module378 executes, hard coded and/or operational instructions correspondingto at least some of the steps and/or functions illustrated in FIGS.87-92.

In an example of operation, the radar system 376 functions to detectlocation information regarding objects (e.g., object A, B, and/or C) inits scanning area 386. The location information may be expressed in twodimensional or three dimensional terms and may vary with time (e.g.,velocity and acceleration). The location information may be relative tothe radar system 376 or it may be absolute with respect to a more globalreference (e.g., longitude, latitude, elevation). For example, relativelocation information may include distance between the object and theradar system 376 and/or angle between the object and the radar system376.

The scanning area 386 includes the radiation pattern of each of theradar devices 1-R. For example, each radar device 1-R transmits andreceives radar signals over the entire scanning area 386. In anotherexample, each radar device 1-R transmits and receives radar signals to Runique portions of the scanning area 386 with substantially no overlapof their radiation patterns. In yet another example, some radar deviceshave overlapping radiation patterns while others do not.

The radar system 376 may detect objects and determine the locationinformation in a variety of ways in a variety of frequency bands. Theradar devices 1-R may operate in the 60 GHz band or any other band inthe 30 MHz to 300 GHz range as a function of coverage optimization andsystem design goals to meet the needs of a particular application. Forexample, 50 MHz is utilized to penetrate the atmosphere to scan objectsin earth orbit while 60 GHz can be utilized to scan for vehicles one tothree car lengths from a radar equipped vehicle where the atmosphericeffects are minimal. The radar devices 1-R operate in the same ordifferent frequency ranges.

The location information may be determined by the radar system 376 whenthe radar system 376 is operating in different modes including one ormore of each radar device operating independently, two or more radardevices operating collectively, continuous wave (CW) transmission, pulsetransmission, separate transmit (TX) and receive (RX) antennas, andshared transmit (TX) and receive (RX) antennas. The radar devices mayoperate under the control of the processing module 378 to configure theradar devices to operate in accordance with the operating mode.

For example, in a pulse transmission mode, the processing module 378sends a control signal 388 to the radar device to configure the mode andoperational parameters (e.g., pulse transmission, 60 GHz band, separatetransmit (TX), and receive (RX) antennas, work with other radardevices). The control signal 388 includes operational parameters foreach of the transceiver module 384, the shaping module 382, and theantenna module 380. The transceiver 384 receives the control signal 388and configures the transceiver 384 to operate in the pulse transmissionmode in the 60 GHz band.

The transceiver module 384 may include one or more transmitters and/orone or more receivers. The transmitter may generate an outbound wirelesssignal 390 based on an outbound control signal 388 from the processingmodule 378. The outbound control signal 388 may include controlinformation to operate any portion of the radar device and may containan outbound message (e.g., a time stamp) to embed in the outbound radarsignal. Note that the time stamp can facilitate determining locationinformation for the CW mode or pulse mode.

In the example, the transceiver 384 generates a pulse transmission modeoutbound wireless signal 390 and sends it to the shaping module 382.Note that the pulse transmission mode outbound wireless signal 390 mayinclude a single pulse, and/or a series of pulses (e.g., pulse widthless than 1 nanosecond every millisecond to once every few seconds). Theoutbound radar signal may include a time stamp message of when it istransmitted. In an embodiment, the transceiver 384 converts the timestamp message into an outbound symbol stream and converts the outboundsymbol stream into an outbound wireless signal 390. In anotherembodiment, the processing module 378 converts the outbound message intothe outbound symbol stream.

The shaping module 382 receives the control signal 388 (e.g., in theinitial step from the processing module 378) and configures to operatewith the antenna module 380 with separate transmit (TX) and receive (RX)antennas. The shaping module 382 produces one or more transmit shapedsignals 392 for the antenna module 380 based on the outbound wirelesssignal 390 from the transceiver 384 and on the operational parametersbased on one or more of the outbound control signal 388 from theprocessing module 378 and/or operational parameters from the transceiver384. The shaping module 382 may produce the one or more transmit shapedsignals 392 by adjusting the amplitude and phase of outbound wirelesssignal differently for each of the one or more transmit shaped signals392.

The radar device antenna module 380 radiates the outbound radar signal394 creating a transmit pattern in accordance with the operationalparameters and mode within the scanning area 386. The antenna module 380may include one or more antennas. Antennas may be shared for bothtransmit and receive operations. Note that in the example, separateantennas are utilized for TX (e.g., in the radar device) and RX (e.g.,in a second radar device).

Antenna module antennas may include any mixture of designs includingmonopole, dipole, horn, dish, patch, microstrip, isotron, fractal, yagi,loop, helical, spiral, conical, rhombic, j-pole, log-periodic, slot,turnstile, collinear, and nano. Antennas may be geometrically arrangedsuch that they form a phased array antenna when combined with thephasing capabilities of the shaping module 382. The radar device mayutilize the phased array antenna configuration as a transmit antennasystem to transmit outbound radar signals 394 as a transmit beam in aparticular direction of interest.

In the example, the second radar device receives an inbound radar signal394 via its antenna module 380 that results from the outbound radarsignal 394 reflecting, refracting, and being absorbed in part by the oneor more objects (e.g., objects A, C, and/or C) in the scanning area 386.The second radar device may utilize the phased array antennaconfiguration as a receive antenna system to receive inbound radarsignals 394 to identify a direction of its origin (e.g., a radar signalreflection off an object at a particular angle of arrival).

The antenna module 380 of the second radar device sends the inboundradar signal 394 to its shaping module 382 as a shaped signal 392. Theshaped signal 392 may be the result of the inbound radar signal 394impinging on one or more antennas that comprise the antenna module 380(e.g., an array). For example, the amplitude and phase will varyslightly between elements of a phased array.

The shaping module 382 produces one or more inbound wireless signals forthe transceiver based on one or more receive shaped signals 392 from theantenna module 380 and on the operational parameters from one or more ofthe processing module 378 and/or the transceiver 384. The shaping module382 may produce the one or more inbound wireless signals 390 byadjusting the amplitude and phase of one or more receive shaped signals392 differently for each of the one or more receive shaped signals 392.

In an embodiment, the second radar device transceiver 384 generates aninbound control signal 388 based on the inbound wireless signal 390 fromits shaping module 382. The inbound control signal 388 may include thestatus of the operational parameters, inbound wireless signal parameters(e.g., amplitude information, timing information, phase information),and an inbound message decoded from the inbound wireless signal. Thetransceiver 384 converts the inbound wireless signal 390 into an inboundsymbol stream and converts the inbound symbol stream into the inboundmessage (e.g., to decode the time stamp). In another embodiment, theprocessing module 378 converts the inbound symbol stream into theinbound message.

The processing module 378 determines location information about theobject based on the inbound radar signal 394 received by the radardevice. In particular, the processing module 378 may determine thedistance to the object based on the time stamp and the time at which theradar device received the inbound radar signal 394. Since the radarsignals 394 travel at the speed of light, the distance can be readilydetermined.

In another example, where the mode is each radar device operatingindependently, each radar device transmits the outbound radar signal 394to the scanning area 386 and each radar device receives the inboundradar signal 394 resulting from the reflections of the outbound radarsignal 394 off the one or more objects. Each radar device utilizes itsantenna module 380 to provide the processing module 378 with controlsignals 388 that can reveal the location information of an object withreference to the radar device. For example, the processing module 378determines the location of the object when two radar devices at a knowndistance apart provide control signals 388 that reveal the angle ofarrival of the inbound radar signal 394.

In another example of operation, the processing module 378 determinesthe operational parameters for radar devices 1 and 2 based on therequirements of the application (e.g., scanning area size and refreshrates of the location information). The processing module 378 sends theoperational requirements to the radar devices (e.g., operate at 60 GHz,configure the transmit antenna of each radar device for anomni-directional pattern, transmit a time stamped 1 nanosecond pulseevery 1 millisecond, sweep the scanning area 386 with a phased arrayantenna configuration in each radar device). The antenna module 380, theshaping module 382, and the transceiver 384 configure in accordance withthe operational parameters. The receive antenna array may be initiallyconfigured to start at a default position (e.g., the far left directionof the scanning area 386).

The transceiver 384 generates the outbound wireless signal 390 includingthe time stamped outbound message. The shaping module 382 passes theoutbound wireless signal 390 to the omni-directional transmit antennawhere the outbound radar signal 394 is radiated into the scanning area386. The inbound radar signal 394 is generated by a reflection off ofobject A. The receive antenna array captures the inbound radar signal394 and passes the inbound wireless signal 390 to the transceiver 384.The transceiver 384 determines the distance to object A based on thereceived time stamp message and the received time. The transceiver 384forms the inbound control signal 388 based on the determination of theamplitude of the inbound wireless signal 390 for this pulse and sendsthe inbound control signal 388 to the processing module 378 where it issaved for later comparison to similar data from subsequent pulses.

In the example, the transceiver module 384 and/or processing module 378determines and sends updated operational parameters to the shapingmodule 382 to alter the pattern of the receive antenna array prior totransmitting the next outbound radar signal 394. The determination maybe based on a pre-determined list or may be based in part on an analysisof the received information so far (e.g., track the receive antennapattern towards the object where the pattern yields a higher amplitudeof the inbound wireless signal).

The above process is repeated until each radar device has produced aninbound wireless signal peak for the corresponding receive antenna arraypattern. The processing module 378 determines the angle of arrival ofthe inbound radar signal 394 to each of the radar devices based on thereceive antenna array settings (e.g., shaping module operationalparameters and antennas deployed). The processing module 378 determinesthe location information of object A based on the angle of arrival ofthe inbound radar signals 394 to the radar devices (e.g., where thoselines intersect) and the distance and orientation of the radar devicesto each other. The above process repeats until the processing module 378has determined the location information of each object A, B, and C inthe scanning area 386.

Note that the transceiver 384, shaping module 382, and antenna module380 may be combined into one or more radar device integrated circuitsoperating at 60 GHz. As such, the compact packaging more readilyfacilitates radar system applications including player motion trackingfor gaming consoles and vehicle tracking for vehicular basedanti-collision systems. The shaping module 382 and antenna module 380together may form transmit and receive beams to more readily identifyobjects in the scanning area 386 and determine their locationinformation.

With the inclusion of a PAMM, the antenna structure 380 can have a fullhorizon to horizon sweep, thus substantially eliminating blind spots ofradar systems for objects near the horizon (e.g., substantiallyeliminates avoiding radar detection by “flying below the radar”). Thisis achievable since the PAMM substantially eliminates surfaces wavesthat dominate conventional antenna structures for signals having asignificant angle of incidence (e.g., greater than 60 degrees). Withoutthe surface waves, the in-air beam can be detected even to an angle ofincidence near 90 degrees.

FIG. 88 is a schematic block diagram of an embodiment of an antennastructure 380 and the shaping module 382 of the radar system of FIG. 87.The antenna structure 380 includes a plurality of transmit antennas 1-T,a plurality of receive antennas 1-R, and a common projected artificialmagnetic mirror (PAMM) 396. The shaping module 382 includes a switching& combining module 398 and a phasing & amplitude module 400 that operatein combination to adjust the phase and amplitude of signals passingthrough them.

The shaping module 382 manipulates the outbound wireless signal 402 fromthe transceiver to form a plurality of transmit shaped signals 1-T thatare applied to TX antennas 1-T. For example, the shaping module 382outputs four transmit shaped signals 1-4 where each transmit shapedsignal has a unique phase and amplitude compared to the other three. Theantenna module 380 forms a transmit beam (e.g., the composite outboundradar signal 406 at angle Φ) when the TX antennas 1-4 are excited by thephase and amplitude manipulated transmit shaped signals 1-4. In anotherexample, the shaping module 382 may pass the outbound wireless signal402 from the transceiver directly to a single TX antenna utilizing anomni-directional antenna pattern to illuminate at least a portion of thescanning area with the outbound radar signal.

The composite outbound radar signal 406 may reflect off of the object inthe scanning area and produce reflections that travel in a plurality ofdirections based on the geometric and material properties of the object.At least some of the reflections may produce the inbound radar signalthat propagates directly from the object to the RX antenna while otherreflections may further reflect off of other objects and then propagateto the RX antenna (e.g., multipath).

The shaping module 382 may manipulate receive shaped signals 1-R fromthe RX antennas 1-R to form the inbound wireless signal 494 that is sentto the transceiver. The antenna module 380 forms the composite inboundradar signal 408 based on the inbound radar signals 1-R and the antennapatterns of each of the RX antennas 1-R. For example, the antenna module380 forms a receive antenna array with six RX antennas 1-6 to capturethe inbound radar signals 1-6 that represent the composite inbound radarsignal 408 to produce the receive shaped signals 1-6. The shaping module382 receives six receive shaped signals 1-6 where each receive shapedsignal has a unique phase and amplitude compared to the other five basedon the direction of origin of the inbound radar signal and the antennapatterns of RX antennas 1-6. The shaping module 382 manipulates thephase and amplitude of the six receive shaped signals 1-6 to form theinbound wireless signal 404 such that the amplitude of the inboundwireless signal 404 will peak and/or the phase is an expected value whenthe receive antenna array (e.g., resulting from the operationalparameters of the shaping module 382 and the six antenna patterns) issubstantially aligned with the direction of the origin of inbound radarsignal (e.g., at angle β). The transceiver module detects the peak andthe processing module determines the direction of origin of the inboundradar signal.

The shaping module 382 may receive new operational parameters from thetransceiver and/or processing module to further refine either or both ofthe transmit and receive beams to optimize the search for the object.For example, the transmit beam may be moved to raise the general signallevel in a particular area of interest. The receive beam may be moved torefine the composite inbound radar signal angle 408 of arrivaldetermination. Either or both of the transmit and receive beams may bemoved to compensate for multipath reflections where such extrareflections are typically time delayed and of a lower amplitude than theinbound radar signal from the direct path from the object.

Note that the switching and combining module 398 and the phasing andamplitude module 400 may be utilized in any order to manipulate signalspassing through the shaping module 382. For example, the transmit shapedsignal may be formed by phasing, amplitude adjustment, and thenswitching while the receive shaped signal may be combined, switched,phased, and amplitude adjusted. Further note that the antenna structure380 may be implement in accordance with one or more of the antennastructures described herein.

FIG. 89 is a schematic block diagram of another embodiment of theantenna structure 380 and the shaping module 382 of the radar system ofFIG. 87, which is similar to the corresponding structures of FIG. 88with the exception that each antenna has its own projected artificialmagnetic mirror (PAMM) 396. With this configuration of the antennastructure 380, each antenna may be separately configured and/or adjustedby manipulating its PAMM 396.

To support the configuration of the PAMMs 396, the radar system furtherincludes a PAMM control module 410. The PAMM control module 410 issuescontrol signals 412 to each of the PAMM 396 to achieve the desiredconfiguration. For example, each of the antennas may include aneffective dish antenna as shown in FIG. 77, where the effective dishshape and/or the focal point of the dish can be changed. As an alternateexample, the PAMMs 396 may include adjustable coils as shown in FIGS.66-76 such that the properties (e.g., frequency band, band gap, bandpass, amplifier, electric wall, magnetic wall, etc.) of the PAMMs 396can be changed.

FIG. 90 is a schematic block diagram of an example of the radar systemthat includes the processing module (not shown), the shaping module 382,the PAMM control module 410, and the antenna structure. The antennastructure includes a transmit effective dish array 414 and a receiveeffective dish array 416. Each of the effective dish arrays includes aplurality of effective dish antennas. The shaping module 382 includesthe phasing & amplitude module 398 and the switching & combining module400.

This example begins with the radar system scanning for an object 418.The processing module coordinates the scanning, which is implemented inconcert by the shaping module and the PAMM control module 410. Forinstance, the processing module issues a command to scan in a particularpattern (e.g., from horizon to horizon, in a particular region, etc.) tothe PAMM control module 410 and to the shaping module 382. The commandindicates the sweeping range (e.g., the variance of the angle oftransmission and the angle of reception), the sweeping rate (e.g., howoften the angles are changed), and the desired composite antennaradiation pattern. In addition to issuing the scanning command, theprocessing module generates at least one outbound signal 402.

For a seeking scan (e.g., no objects currently being tracked), theprocessing module issues the command to sweep from horizon to horizonwith a wide antenna radiation pattern at a rate of 1 second. As anotherexample, the processing module issues the command to sweep in aparticular region (e.g., limited range for the transmission andreception angles) with a narrower radiation pattern at a rate of 500mSec. Accordingly, the processing module may issue the command to sweepover any range of angles, with a variety of antenna radiation patternsand a variety of rates.

In response to the command, the PAMM control module 410 generates TXPAMM control signals 420 and RX PAMM control signals 422. The TX PAMMcontrol signals 420 (e.g., one for each effective dish antenna) shapesthe effective dish for the corresponding antenna. As an example ofproviding a wide antenna radiation pattern, the left effective dishantenna of the TX effective dish array 414 is configured to have aradiation pattern that is off normal by a set amount to the left. Thecenter effective dish antenna of the TX effective dish array 414 isconfigured to have a normal radiation pattern (e.g., no offset) and theright effective dish antenna is configured to have a radiation patternthat is off normal by a set amount to the right. In this manner,composite radiation pattern is essential the sum of the three individualradiation patterns, which is wider than an individual radiation pattern.Note that the TX effective dish array 414 may include more than threeeffective dish antennas and the composite radiation pattern isthree-dimensional. The RX effective dish array 416 is configured in asimilar manner.

The shaping module 382 receives the outbound signal generates one ormore shaped TX signals 424 based on the command. For example, if thecommand is to sweep from horizon to horizon, the shaping modulegenerates an initial set of shaped TX signals 424 to have an angle suchthat, when the shaped TX signals 424 are transmitted via the TXeffective dish array 414, the signals are transmitted along the horizonto the left of the radar system. The particular initial transmit angle(θ) depends on the breadth of the radiation pattern of the TX effectivedish array. For example, the radiation pattern of the TX effective disharray 414 may be 45 degrees, thus the shaping module 382 will set theinitial TX angle to 67.5 degrees (e.g., 90-22.5). As another example, ifthe TX effective dish array 414 has a 180-degree radiation pattern, thenthe shaping module 382 would set the initial TX angle to 0 and therewould be no sweeping rate, since the radiation patterns covers fromhorizon to horizon.

When the radiation pattern of the TX effective dish array 414 is lessthan the 180 degrees, the shaping module 382 reshapes the outboundsignal 402 to yield a new transmit angle (θ) at the sweep rate. Theshaping module 382 continues reshaping the outbound signal 402 to yieldnew transmit angles until the sweep has swept from horizon to horizonand then the process is repeated.

While the shaping module 382 is generating the TX shaped signals 424, itmay be receiving RX shaped signals 426 from the RX effective dish array416 when an object 418 is present in the TX and RX antenna radiationpatterns. Note that the RX antenna radiation pattern is adjusted in asimilar manner as the TX antenna radiation pattern and substantiallyoverlaps the TX antenna radiation pattern.

In this example, the RX effective dish array 414 receives reflected TXsignals 424, refracted TX signals, or object-transmitted signals fromthe object 418 when it is in the RX antenna radiation pattern. The RXeffective dish array 414 provides the RX signals 426 to the shapingmodule 382, which processes them as discussed above to produce aninbound signal 404. The processing module processes the inbound signalto determine the general location of the newly detected object 418.

FIG. 91 is a schematic block diagram that continues with the example ofFIG. 90 after the radar system detects the object 418. As discussed withreference to FIG. 90, the processing module determines the generallocation of the newly detected object 418. To better track the motion ofthe object, the processing module generates a command to focus theantenna radiation patterns and the TX shaped signals 424 to the generallocation of the object 428.

The PAMM control module 410 receives the command and, in response,generates updated TX and RX PAMM control signals 420-422. As shown inthis example, the TX control signals 420 adjusts the effective dishantennas of the TX effective dish array 414 to each have a radiationpattern that is more orientated towards the object 418. The effectivedish antennas of the RX effective dish array 416 are adjusted in asimilar manner.

The shaping module 382 generates the TX shaped signals 424 from theoutbound signals 402 in accordance with the command. This furtherfocuses on the object 418 (at least to the point of its generallocation). The shaping module 382 performs similar shaping functions onthe RX shaped signals 426 to produce the inbound signal 404. Theprocessing module interprets the inbound signal 404 to update theobject's current position.

FIG. 92 is a schematic block diagram that continues with the example ofFIGS. 90 and 91. As the processing module updates the object's position,it determines the object's motion. As such, the processing module istracking the object 418 and may be able to predict its future locationsbased on its previous locations. Using this information, the processingmodule generates a command (e.g., an object motion tracking controlsignal) for the PAMM control module 410 and the shaping module 382 tocontinue focusing on the object 418.

While the radar system is tracking the object 418, it may also performsweeps to detect other objects. For example, one or more of theeffective dish antennas of the TX effective dish array 414 may be usedto track the motion of the detected object 418, while other effectivedish antennas are used for scanning. The effective dish antennas of theRX effective dish array 416 would be allocated in a similar manner. Asanother example, the processing module may issue a command thatcontinues the focused antenna radiation pattern and focused shapedsignals, but continues with the sweeping. In this manner, a more focusedsweep is performed.

FIG. 93 is a cross sectional diagram of an embodiment of a lateralantenna structure that includes a metal backing 428, a first dielectric430, a projected artificial magnetic mirror (PAMM) 432, a seconddielectric 434, an antenna 436, and a third dielectric 438. Each of thedielectric layers may be of the same material (e.g., a layer of a die,package substrate, PCB, etc.) or of a different material. The antenna436 may a dipole, monopole, or other antenna as discussed herein.

With the dielectric 438 above the antenna 436, it functions as awaveguide or superstrate that channels the radiated energy of theantenna lateral to the antenna 436 as opposed to perpendicular to it.The PAMM 432 functions a previously discussed to mirror the electricfield signals being transceived by the antenna 436.

FIG. 94 is a schematic block diagram of another embodiment of a radarsystem that includes the processing module (not shown), the shapingmodule 382, and an antenna structure 380. The processing module and theshaping module 382 function as previously discussed.

The antenna structure 380 includes a plurality of lateral antennas 436(of FIG. 93) and one or more effective dish antennas 264 (of FIGS.60-62). As shown, a first lateral antenna 436 has a +90 degree radiationpattern and a second lateral antenna 436 has a −90 degree radiationpattern. The effective dish antenna 264 has a 0 degree radiationpattern. With a few antennas, a near horizon-to-horizon compositeradiation pattern is obtained. As previously discussed, using a PAMM 396with an antenna substantially eliminates surface waves and currents thatlimit the transmit and receive angle of conventional antennas. With thislimitation removed, the radar system can detect an object at any angle.Thus, there are no blind spots for the radar system.

FIG. 95 is a cross section diagram of an embodiment of an antennastructure that may be used in a radar system. The antenna structureincludes a metal backing 428, a first dielectric 430, a projectedartificial magnetic mirror (PAMM) 432, a second dielectric 434, aplurality of antennas 436, and a plurality of third dielectrics 438.Each of the dielectric layers may be of the same material (e.g., a layerof a die, package substrate, PCB, etc.) or of a different material. Eachof the antennas may a dipole, a monopole, or other antenna as discussedherein.

The third dielectrics 438 over the corresponding antennas 436 createlateral antennas with the lateral radiation patterns as shown. Theuncovered antenna has a perpendicular radiation pattern. As such, anomni-directional antenna array can be achieved using a plurality ofdirectional antennas on-chip, on-package, and/or on a printed circuitboard.

FIG. 96 is a schematic block diagram of an embodiment of a multiplefrequency band projected artificial magnetic mirror (PAMM) that includesa plurality of metal traces 444 (e.g., represented by the inductors(L1-L3) with the gray outline). The metal traces 444 are positioned onone or more layers with various positioning and spacing to producedifferent capacitances therebetween (e.g., C1-C3). With proper sizing ofthe metal traces and positioning thereof, a distributed L-C network canbe obtained that has two or more frequency bands of operation (e.g., thePAMM exhibiting desired properties of an amplifier, a band gap, abandpass, an electrical wall, a magnetic wall, etc.).

In this example, the PAMM has two frequency bands of operation, wherethe first frequency band is lower than the second frequency band. In thefirst frequency band, C1 capacitors are of a capacitance that causesthem to effectively be an open (e.g., at the first frequency, C1capacitors have a high impedance). Capacitors C2 resonant with inductorsL3 to provide a desired impedance. Inductor L2 and capacitor C3 are ofan inductance and capacitance, respectively, that they are minimalaffect in the first frequency band.

Thus, the L1 inductors and the tank circuit of capacitor C2 and inductorL3 to ground (e.g., the metal backing) are dominate in the firstfrequency band. These components may be tuned in the frequency band toprovide the desired PAMM properties.

In the second frequency band, the tank circuits of C2 and L3 are of ahigh impedance, thus they are essentially open circuits. Further,capacitors C1 and inductors L1 are of a low impedance, thus they areessentially short circuits. Thus, inductors L2 and capacitors C3 are theprimary components of the distributed L-C network in the secondfrequency band. Note that the effective switching provided by the tankcircuits (C2 and L3) and coupling capacitors (C1) may be achieved byusing switches (e.g., RF switches, MEMS switches, transistors, etc.).

FIG. 97 is a cross sectional diagram of an embodiment of a multiplefrequency band projected artificial magnetic mirror (PAMM) that includesa first PAMM layer, a second PAMM layer, two dielectric layers 446, ametal backing 450, and a plurality of connections 448. The metal tracesof FIG. 96 may be implemented on the first or the second PAMM layer toachieve the desired inductance and/or associated capacitance. Note thatcapacitors may be specifically fabricated to provide one or more of thecapacitors C1-C3.

FIG. 98 is a diagram of an embodiment of an antenna structure thatincludes a four port decoupling module 452, a dielectric 454, aprojected artificial magnetic mirror (PAMM) 456, and a plurality ofantennas (two antennas are shown in this illustration). As shown, theantennas are physically separated and are at opposite edges of asubstrate. As an example of a 2×2 2.4 GHz antenna, the substrate may bean FR4 substrate that has a size of 20 mm×68 mm with a thickness of 1mm. The radiator portion of the antenna structure may be 20 mm×18 mmsuch that the distance between the antennas is about 20 mm. For higherfrequency antennas, the dimensions would be smaller.

As shown, the antenna structure is coupled to a ground plane 458, whichmay be implemented as a PAMM, and is separated from the PAMM layer 456by the dielectric 454. The four port-decoupling module 452 providescoupling and isolation to the antennas. The four port-decoupling module452 includes four ports (P1-P4), a pair of capacitors (C1, C2), and apair of inductors (L1, L2). The capacitors may be fixed capacitors orvariable capacitors to enable tuning. The inductors may be fixedinductors or variable inductors to enable tuning. In an embodiment, thecapacitance of the capacitors and the inductance of the inductors areselected to provide a desired level of isolation between the ports and adesired impedance within a given frequency range.

FIG. 99 is a diagram of an embodiment of an antenna that includes aplurality of metal traces coupled together by a plurality of vias. Inthis manner of effective length of the antenna exceeds the geometricarea of the antenna.

FIG. 100 is a diagram of an embodiment of a dual band MIN/10 antennahaving a projected artificial magnetic mirror (PAMM) 456. Thisembodiment is similar to that of FIG. 98 with the exception that itincludes a second pair of antennas for a second frequency band.

FIG. 101 is a cross sectional diagram of an embodiment of a multipleprojected artificial magnetic mirrors (PAMM) on a common substrate. Themultiple PAMM structure includes a metal backing 460, a 1^(st) PAMM, a2^(nd) PAMM, connections 462, and two dielectrics 464-466. In thisconfiguration, the first PAMM is on the first dielectric 464 and thesecond PAMM is on the second dielectric 466. Further, the first andsecond PAMMs are vertically offset such that they have little to nooverlapping areas in a vertical direction. Alternatively, the first andsecond PAMMs may have an overlapping section. Note that each of thefirst and second PAMMs may be tuned to the same or different frequencybands.

FIG. 102 is a cross sectional diagram of an embodiment of a multipleprojected artificial magnetic mirrors (PAMM) on a common substrate. Themultiple PAMM structure includes a metal backing 460, a 1^(st) PAMM, a2^(nd) PAMM, connections 462, and a dielectric 464. In thisconfiguration, the first and second PAMMs are on the dielectric 464 andare physically separated such that they have little to no interactiontherebetween. Note that each of the first and second PAMMs may be tunedto the same or different frequency bands.

FIG. 103 a is a cross sectional diagram of an embodiment of a projectedartificial magnetic mirror (PAMM) waveguide that includes a first PAMMassembly (e.g., a plurality of metal patches (1^(st) PAMM), a firstdielectric material 470, and a first metal backing 468), a second PAMMassembly (e.g., a plurality of metal patches (2^(nd) PAMM), a seconddielectric material 470, and a second metal backing 468), and awaveguide area 474.

The PAMM assembly is on a first set of layers of a substrate (e.g., ICdie, IC package substrate, PCB, etc.) to form a firstinductive-capacitive network that substantially reduces surface wavesalong a first surface of the substrate within a first given frequencyband as previously discussed. The second PAMM assembly is on a secondset of layers of the substrate to form a second inductive-capacitivenetwork that substantially reduces surface waves along a second surfaceof the substrate within a second given frequency band. Note that thefirst given frequency band has a frequency range that is substantiallysimilar to a frequency range of the second given frequency band; thatsubstantially overlaps the frequency range of the second given frequencyband; and/or that is substantially non-overlapping with the frequencyrange of the second given frequency band.

The first and second PAMM assemblies function to contain anelectromagnetic signal substantially within the waveguide area 474. Forexample, if the electromagnetic signal is an RF or MMW signal radiatedfrom an antenna proximally located to the waveguide area, energy of theRF or MMW signal will be substantially confined within the waveguidearea.

FIG. 103 b is a cross sectional diagram of another embodiment of aprojected artificial magnetic mirror (PAMM) waveguide that includes aplurality of metal patches (e.g., 1^(st) PAMM), a metal backing 468, awaveguide area 474, and three dielectric layers 470, which may be of thesame dielectric material, different dielectric material, or acombination thereof. The plurality of metal patches is on a first layerof a substrate (e.g., IC die, IC package substrate, PCB, etc.) and themetal backing is on a second layer of the substrate. The first of thedielectric materials is between the first and second layers of thesubstrate and the second of the dielectric materials is juxtaposed tothe plurality of metal patches. The waveguide area 474 is between thesecond and third dielectric materials.

In an example of operation, the plurality of metal patches iselectrically coupled (e.g., direct or capacitively) to the metal backing468 to form an inductive-capacitive network that substantially reducessurface waves along a surface of the substrate within a given frequencyband. With the waveguide area 474 between the second and thirddielectric materials, at least one of the inductive-capacitive network,the second dielectric material, and the third dielectric materialfacilitates confining an electromagnetic signal within the waveguidearea 474. For instance, the PAMM layer reflects energy ofelectromagnetic signals into the waveguide area 474 and the thirddielectric (e.g., the one pictured above the waveguide area 474)channels radiated energy laterally along its surface.

FIG. 103 c is a cross-sectional diagram of an embodiment of thewaveguide area 474 that includes first and second connections 471 and473. The connections 471 and 473 may be metal traces, antennas,microstrips, etc. on a layer of the substrate and are operable tocommunicate the electromagnetic signal. The waveguide area 474 mayfurther include air and/or a dielectric material as a waveguidedielectric (i.e., the material filling the waveguide area 474).

FIG. 103 d is a cross-sectional diagram of another embodiment of thewaveguide area 474 that includes the first and second connections 471and 473 and a fourth dielectric material 470, which includes an airsection 477. The connections 471 and 473 are on a layer of the substrateand are positioned within the air section 477. In this manner, theelectromagnetic signal communicated between the first and secondconnections 471 and 473 is substantially confined to the air section477.

FIG. 104 is a diagram of an embodiment of an-chip projected artificialmagnetic mirror interface for in-band communications. In this example, aPAMM 478 layer includes one or more feedthroughs 476 that enable in-bandsignals to be communicated between a circuit 484 on one side of the PAMM478 and a connector 482 (or other circuit) on the other side of the PAMM478. The connectors 482 may be electrical connections or opticalconnectors.

FIG. 105 is a cross sectional diagram of an embodiment of a projectedartificial magnetic mirror (PAMM) 484 to a lower layer. As shown, thecircuit element 494 is on a lower level than the PAMM layer 484.

FIG. 106 is a diagram of an embodiment of a transmission line 496coupled to one or more circuit components 506. The transmission line 496is fabricated on an outer layer 498 of a die and/or package substrateand a projected artificial magnetic mirror (PAMM) 500 is fabricated onan inner layer 502 of the die and/or package substrate. The circuitcomponents 506 are fabricated on one or more layers of the die and/orpackage substrate, which may be the bottom layer 508. A metal backing510 is fabricated on the bottom layer 508. While not shown, thetransmission line 496 may be coupled to an antenna structure and/or toan impedance matching circuit.

The projected artificial magnetic mirror (PAMM) 500 includes at leastone opening to allow one or more connections to pass there-through, thusenabling electrical connection of the transmission line 496 to one ormore of the circuit components 506 (e.g., a power amplifier, a low noiseamplifier, a transmit/receive switch, an circulator, etc.). Theconnections 504 may be metal vias that are may or may not be insulated.

FIG. 107 is a diagram of an embodiment of a filter 512 having aprojected artificial magnetic mirror (PAMM) 500. The filter 512 isfabricated on an outer layer 498 of a die and/or package substrate andthe PAMM 500 is fabricated on an inner layer 502 of the die and/orpackage substrate. The circuit components 506 are fabricated on one ormore layers of the die and/or package substrate, which may be the bottomlayer 508. A metal backing 510 is fabricated on the bottom layer 508.While not shown, the filter 512 may be coupled to one or more of thecircuit components 506.

The projected artificial magnetic mirror (PAMM) 500 may include at leastone opening to allow one or more connections to pass there-through, thusenabling electrical connection of the filter 512 to one or more of thecircuit components 506 (e.g., a power amplifier, a low noise amplifier,a transmit/receive switch, an circulator, etc.). The connections may bemetal vias that are may or may not be insulated.

FIG. 108 is a diagram of an embodiment of an inductor 514 having aprojected artificial magnetic mirror (PAMM) 500. The inductor 514 isfabricated on an outer layer 498 of a die and/or package substrate andthe PAMM 500 is fabricated on an inner layer 502 of the die and/orpackage substrate. The circuit components 506 are fabricated on one ormore layers of the die and/or package substrate, which may be the bottomlayer 508. A metal backing 510 is fabricated on the bottom layer 508.While not shown, the inductor 514 may be coupled to one or more of thecircuit components 506.

The projected artificial magnetic mirror (PAMM) 500 may include at leastone opening to allow one or more connections to pass there-through, thusenabling electrical connection of the inductor 514 to one or more of thecircuit components 506 (e.g., a power amplifier, a low noise amplifier,a transmit/receive switch, an circulator, etc.). The connections may bemetal vias that are may or may not be insulated.

FIG. 109 is a cross sectional diagram of an embodiment of an antennastructure on a multi-layer die and/or package substrate 516. The antennastructure includes one or more antennas 518, a projected artificialmagnetic mirror (PAMM) 520, and a metal backing 522. The die and/orpackage substrate 516 may also support circuit components 524 on otherlayers 526.

In this embodiment, the one or more antennas 518 are coplanar with thePAMM 520. The PAMM 520 may be adjacent to the antenna(s) 518 or encirclethe antenna(s) 518. The PAMM 520 is constructed to have a magnetic wallthat is at the level of the PAMM 520 (as opposed to above or below it).In this instance, the antenna 518 can be coplanar and exhibit theproperties previously discussed.

As may be used herein, the terms “substantially” and “approximately”provides an industry-accepted tolerance for its corresponding termand/or relativity between items. Such an industry-accepted toleranceranges from less than one percent to fifty percent and corresponds to,but is not limited to, component values, integrated circuit processvariations, temperature variations, rise and fall times, and/or thermalnoise. Such relativity between items ranges from a difference of a fewpercent to magnitude differences. As may also be used herein, theterm(s) “operably coupled to”, “coupled to”, and/or “coupling” includesdirect coupling between items and/or indirect coupling between items viaan intervening item (e.g., an item includes, but is not limited to, acomponent, an element, a circuit, and/or a module) where, for indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.As may even further be used herein, the term “operable to” or “operablycoupled to” indicates that an item includes one or more of powerconnections, input(s), output(s), etc., to perform, when activated, oneor more its corresponding functions and may further include inferredcoupling to one or more other items. As may still further be usedherein, the term “associated with”, includes direct and/or indirectcoupling of separate items and/or one item being embedded within anotheritem. As may be used herein, the term “compares favorably”, indicatesthat a comparison between two or more items, signals, etc., provides adesired relationship. For example, when the desired relationship is thatsignal 1 has a greater magnitude than signal 2, a favorable comparisonmay be achieved when the magnitude of signal 1 is greater than that ofsignal 2 or when the magnitude of signal 2 is less than that of signal1.

While the transistors in the above described figure(s) is/are shown asfield effect transistors (FETs), as one of ordinary skill in the artwill appreciate, the transistors may be implemented using any type oftransistor structure including, but not limited to, bipolar, metal oxidesemiconductor field effect transistors (MOSFET), N-well transistors,P-well transistors, enhancement mode, depletion mode, and zero voltagethreshold (VT) transistors.

The present invention has also been described above with the aid ofmethod steps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claimed invention.

The present invention has been described above with the aid offunctional building blocks illustrating the performance of certainsignificant functions. The boundaries of these functional buildingblocks have been arbitrarily defined for convenience of description.Alternate boundaries could be defined as long as the certain significantfunctions are appropriately performed. Similarly, flow diagram blocksmay also have been arbitrarily defined herein to illustrate certainsignificant functionality. To the extent used, the flow diagram blockboundaries and sequence could have been defined otherwise and stillperform the certain significant functionality. Such alternatedefinitions of both functional building blocks and flow diagram blocksand sequences are thus within the scope and spirit of the claimedinvention. One of average skill in the art will also recognize that thefunctional building blocks, and other illustrative blocks, modules andcomponents herein, can be implemented as illustrated or by discretecomponents, application specific integrated circuits, processorsexecuting appropriate software and the like or any combination thereof.Further, a concept discussed with reference to particular figure may beapplicable with a concept discussed with reference to another figureeven though not specifically mentioned.

1. A projected artificial magnetic mirror (PAMM) effective dishcomprises: a concentric coil on a layer of a substrate, wherein theconcentric coil has a radiation pattern that is substantially normal toa plane of the concentric coil; an eccentric coil on the layer of thesubstrate, wherein the eccentric coil has a radiation pattern that's isoffset from normal to a plane of the eccentric coil; a metal backing onanother layer of the substrate; and a dielectric material between thelayer and the other layer of the substrate, wherein the concentric coiland the eccentric coil are electrically coupled to the metal backing toproduce a distributed inductor-capacitor networking that provides a PAMMfocal point based on a combination of the radiation patterns of theconcentric coil and the eccentric coil.
 2. The PAMM effective dish ofclaim 1 further comprises: a plurality of concentric coils that includesthe concentric coil; and a plurality of eccentric coils that includesthe eccentric coil, wherein the plurality of eccentric coils at leastpartially surrounds the plurality of concentric coils.
 3. The PAMMeffective dish of claim 2 further comprises: a plurality of secondeccentric coils, wherein a second eccentric coil of the plurality ofsecond eccentric coils has a second radiation pattern that is offsetfrom normal to a plane of the second eccentric coil, and wherein theplurality of second eccentric coils at least partially surrounds theplurality of eccentric coils.
 4. The PAMM effective dish of claim 2further comprises: the plurality of concentric coils arranged in a firstpattern; and the plurality of concentric coils arranged in a patterncorresponding to the first pattern.
 5. The PAMM effective dish of claim2 further comprises: an imbalance pattern of the plurality of eccentriccoils to offset the focal point from a center of the plurality ofconcentric coils.
 6. The PAMM effective dish of claim 1, wherein theconcentric coil comprises: a metal trace having a spiral shape.
 7. ThePAMM effective dish of claim 1 further comprises: the concentric coilincluding a plurality of metal segments and a plurality of switchingelements to configure a shape for the concentric coil; and the eccentriccoil include a second plurality of metal segments and a second pluralityof switching elements to configure a shape for the eccentric coil. 8.The PAMM effective dish of claim 1, wherein the electrical couplingcomprises at least one of: a direct electrical using a via; and acapacitive coupling.
 9. A flat dish antenna comprises: a plurality ofconcentric coils on a layer of a substrate, wherein a concentric coil ofthe plurality of concentric coils has a radiation pattern that issubstantially normal to a plane of the concentric coil; a plurality ofeccentric coils on the layer of the substrate, wherein an eccentric coilof the plurality of eccentric coils has a radiation pattern that's isoffset from normal to a plane of the eccentric coil, wherein theplurality of eccentric coils at least partially surrounds the pluralityof concentric coils; a metal backing on another layer of the substrate;a dielectric material between the layer and the other layer of thesubstrate, wherein the plurality of concentric coils and the pluralityof eccentric coils are electrically coupled to the metal backing toproduce a distributed inductor-capacitor networking that provides afocal point based on a combination of the radiation patterns of theplurality of concentric coil and the plurality of eccentric coil; and anantenna structure located proximal to the focal point.
 10. The flat dishantenna of claim 9, wherein the antenna structure comprises at least oneof: a monopole antenna; a dipole antenna; a plurality of discreteantenna elements; and a helical coil antenna.
 11. The flat dish antennaof claim 9 further comprises: the antenna structure on still anotherlayer of the substrate, wherein the substrate includes at least one ofan integrated circuit (IC) die, an IC package substrate, a printedcircuit board, plastic substrate for automobile parts, andnon-conductive building material for homes or buildings.
 12. The flatdish antenna of claim 9 further comprises at least one of: the pluralityof concentric coils having a first size and the plurality of eccentriccoils having a corresponding first size to establish a 60 GHz frequencyband of operation; the plurality of concentric coils having a secondsize and the plurality of eccentric coils having a corresponding secondsize to establish a satellite C-band of operation; the plurality ofconcentric coils having a third size and the plurality of eccentriccoils having a corresponding third size to establish a satellite K-bandof operation; the plurality of concentric coils having a fourth size andthe plurality of eccentric coils having a corresponding fourth size toestablish a 1800-1900 MHz frequency band of operation; the plurality ofconcentric coils having a fifth size and the plurality of eccentriccoils having a corresponding fifth size to establish a 2.4 GHz frequencyband of operation; and the plurality of concentric coils having a sixthsize and the plurality of eccentric coils having a corresponding sixthsize to establish a 5 GHz frequency band of operation.
 13. The flat dishantenna of claim 9 further comprises: a plurality of second eccentriccoils, wherein a second eccentric coil of the plurality of secondeccentric coils has a second radiation pattern that is offset fromnormal to a plane of the second eccentric coil, and wherein theplurality of second eccentric coils at least partially surrounds theplurality of eccentric coils.
 14. The flat dish antenna of claim 9further comprises: the plurality of concentric coils arranged in a firstpattern; and the plurality of concentric coils arranged in a patterncorresponding to the first pattern.
 15. The flat dish antenna of claim 9further comprises: an imbalance pattern of the plurality of eccentriccoils to offset the focal point from a center of the plurality ofconcentric coils.
 16. The flat dish antenna of claim 9, wherein theconcentric coil comprises: a metal trace having a spiral shape.
 17. Theflat dish antenna of claim 9 further comprises: the concentric coilincluding a plurality of metal segments and a plurality of switchingelements to configure a shape for the concentric coil; and the eccentriccoil include a second plurality of metal segments and a second pluralityof switching elements to configure a shape for the eccentric coil. 18.The flat dish antenna of claim 9, wherein the electrical couplingcomprises at least one of: a direct electrical using a via; and acapacitive coupling.